Subjects : Probe test
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Journal | 2008 | Electrical and Mechanical Characterization of an Anisotropic Conductive Adhesive with a Low Melting Point Solder Eom Yong Sung Microelectronic Engineering, v.85, no.11, pp.2202-2206 | 32 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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