Subjects : 3D IC Integration
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2019 | Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration Choi Kwang-Seong International 3D Systems Integration Conference (3DIC) 2019, pp.1-3 | 3 | 원문 |
| Journal | 2012 | Novel Bumping and Underfill Technologies for 3D IC integration 성기준 ETRI Journal, v.34, no.5, pp.706-712 | 31 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
|---|---|---|---|---|---|
| No search results. | |||||
| Type | Year | Research Project | Primary Investigator | Download |
|---|---|---|---|---|
| No search results. | ||||