Subjects : Cooling structure
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2024 | The Energy-Efficient 10-Chiplet AI Hyperscale NPU on Large-Scale Advanced Package 윤지원 Electronic Components and Technology Conference (ECTC) 2024, pp.1687-1693 | 2 | 원문 |
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