Subjects : copper material
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Journal | 2017 | Large Size of Capacitive Window-Unified TSP Using by Contact Hole Type as an Insulator Seo Woo Hyung Journal of Nanoscience and Nanotechnology, v.17, no.5, pp.3089-3091 | 0 | 원문 |
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