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Conference
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2025 |
Selective Formation of Bonding Materials on Micro-bumps via Laser Non-conductive Film Dipping for 20 μm Pitch Interconnections
Shin Jungho International Symposium on Microelectronics and Packaging (ISMP) 2025, pp.1-18 |
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Journal
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2016 |
Hierarchical Micro/Nano-structured Nanoimprinting Stamp Fabrication for Superhydrophobic Application
김수정 Applied Spectroscopy Reviews, v.51, no.7-9, pp.636-645 |
5 |
원문
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|
Journal
|
2016 |
Hierarchical Micro/Nano-structured Nanoimprinting Stamp Fabrication for Superhydrophobic Application
이선인 Applied Spectroscopy Reviews, v.51, no.7-9, pp.636-645 |
5 |
원문
|