Subjects : Bonded assembly
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2006 | Thermal Analysis and Performance in 1.55um Bottom-Emitting InAlGaAs VCSELs with Dielectric Mirror, Flip-Chip Bonded on Si-Substrate Kim Jong Deog International Conference on Optical Internet and Next Generation Network (COIN-NGNCON) 2006, pp.355-357 | 0 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
|---|---|---|---|---|---|
| No search results. | |||||
| Type | Year | Research Project | Primary Investigator | Download |
|---|---|---|---|---|
| No search results. | ||||