Subjects :
Bonding technique
논문 검색결과
| Type |
Year |
Title |
Cited |
Download |
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Journal
|
2025 |
Reliability Enhancement of 30 μm-Pitch Interconnections via Room-Temperature Laser-Assisted Bonding with Compression (LABC) Using Optimized Laser Non-Conductive Paste (LNCP)
Lee Gaeun Journal of Korean Institute of Metals and Materials, v.63, no.8, pp.583-593 |
0 |
원문
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Journal
|
2018 |
Laser-Assisted Bonding Technology for Interconnections of Multidimensional Heterogeneous Devices
Choi Kwang-Seong 전자통신동향분석, v.33, no.6, pp.50-57 |
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원문
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|
Journal
|
2014 |
Development of a Continuous-Flow Polymerase Chain Reaction Device Utilizing a Polymer Disk with a Spiral Microchannel of Gradually Varying Width
Chung Kwang Hyo Sensors and Actuators B : Chemical, v.191, pp.75-85 |
14 |
원문
|
|
Conference
|
2006 |
Low Noise and Power Amplifier Modules for 60 GHz Wireless Personal Area Network Applications
Mun Jae Kyoung 한국통신학회 종합 학술 발표회 (하계) 2006, pp.861-863 |
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|
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Conference
|
2006 |
Low Noise Amplifier Module for 60 GHz Wireless Personal Area Network (WPAN) utilizing Multilayer Low Temperature Co-fired Ceramic Technology
Mun Jae Kyoung ESA Workshop on Millimetre Wave Technology and Applications 2006, pp.1-4 |
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특허 검색결과
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Family Pat. |
KIPRIS |
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연구보고서 검색결과
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Year |
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