Subjects : 3D TSV
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2017 | Silica Filler Content in NCP and its Effects on the Reliability of 3D TSV Multi-Stack under Thermal Shock Test 주니어 Electronics Packaging Technology Conference (EPTC) 2017, pp.1-8 | 8 | 원문 |
| Conference | 2017 | Development of Stacking Process for 3D TSV (Through Silicon Via) Structure using Laser Choi Kwang-Seong International Microelectronics Assembly and Packaging Society (IMAPS) 2017, pp.1-5 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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