Subjects : Substrate structure
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2021 | Thermal and Electrical Reliability Analysis of TO-247 for Bonding Method, Substrate Structure and Heat Dissipation Bonding Material Donghwan Kim Electronic Components and Technology Conference (ECTC) 2021, pp.1950-1956 | 5 | 원문 |
| Conference | 2015 | Hybrid Substrate Structure for Strain-Free and Readily Stretchable Electronic Circuits Park Chan Woo MRS Meeting 2015 (Spring), pp.1-1 | ||
| Journal | 2006 | A Low-Crosstalk Design of 1.25 Gbps Optical Triplexer Module for FTTH Systems Kim Sungil ETRI Journal, v.28, no.1, pp.9-16 | 21 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
|---|---|---|---|---|---|
| Registered | 2016 | OPTICAL DEVICE AND METHODS FOR MANUFACTURING THE SAME | UNITED STATES | ||
| Registered | 2007 | Silicon-based light emitting diode of high efficiency | UNITED STATES |
| Type | Year | Research Project | Primary Investigator | Download |
|---|---|---|---|---|
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