Subjects : Adhesive strength (68.35.G)
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2015 | Isotropic Conductive Paste Based on Epoxy with Ag Coated Cu and SAC305 Solder Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2015, pp.1-5 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
|---|---|---|---|---|---|
| Registered | 2012 | Operating Method for a WPAN Device | CHINA |
| Type | Year | Research Project | Primary Investigator | Download |
|---|---|---|---|---|
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