Subjects : Thermal deformation
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2018 | Interconnection Process using Laser and Hybrid Underfill for LED Array Module on PET Substrate Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2018, pp.1561-1567 | 15 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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