Subjects : Environmentally sustainable
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2025 | Environmentally Friendly Cu Post Technology Based on Laser-Assisted Bonding with Compression (LABC) and Fume-Free Laser Solder Paste for Advanced 3D Interconnections Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2025, pp.1952-1957 | 0 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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