Subjects : Sintered silver
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2016 | Thermal and Electrical Designs of RF 3D Module Based on Si Interposers with Redundant TSVs Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2016, pp.2051-2057 | 2 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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