Subjects : Storage modulus
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Journal | 2023 | Thermally stable and soft pressure-sensitive adhesive for foldable electronics 정기훈 Chemical Engineering Journal, v.452, no.1, pp.1-8 | 23 | 원문 |
| Journal | 2023 | Thermally stable and soft pressure-sensitive adhesive for foldable electronics 조우성 Chemical Engineering Journal, v.452, no.1, pp.1-8 | 23 | 원문 |
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| Type | Year | Research Project | Primary Investigator | Download |
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