Subjects : proximity sensor
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2023 | 94GHz Fan-Out Wafer-Level Packaging (FOWLP) for High-Resolution Proximity Sensors, Autonomous Driving, and 5G/6G Telecommunication Systems Jiho Joo International Symposium on Microelectronics and Packaging (ISMP) 2023, pp.1-23 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
|---|---|---|---|---|---|
| Registered | 2018 | 근접 센서를 포함하는 송신 장치 및 이를 이용한 생체 통신 방법 | KOREA | KIPRIS |
| Type | Year | Research Project | Primary Investigator | Download |
|---|---|---|---|---|
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