Subjects : Underfill materials
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Journal | 2020 | Epoxy-based Interconnection Materials and Process Technology Trends for Semiconductor Packaging Eom Yong Sung 전자통신동향분석, v.35, no.4, pp.1-10 | 원문 | |
| Conference | 2017 | Solvent-free Fluxing Underfill Film for Electrical Interconnection Keonsoo Jang European Microelectronics and Packaging Conference (EMPC) 2017, pp.1-4 | 3 | 원문 |
| Conference | 2015 | Characterization of Hybrid Underfill for Low-Temperature Process Applicable to Flexible Substrate Jihye Son Electronics Packaging Technology Conference (EPTC) 2015, pp.1-4 | 0 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
|---|---|---|---|---|---|
| No search results. | |||||
| Type | Year | Research Project | Primary Investigator | Download |
|---|---|---|---|---|
| No search results. | ||||