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Conference
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2025 |
Environmentally Friendly Cu Post Technology Based on Laser-Assisted Bonding with Compression (LABC) and Fume-Free Laser Solder Paste for Advanced 3D Interconnections
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2025, pp.1952-1957 |
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원문
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Conference
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2023 |
Flying Over Tourist Attractions: A Novel Augmented Reality Tourism System Using Miniature Dioramas
이수원 ACM SIGGRAPH Asia (SA) 2023, pp.1-2 |
1 |
원문
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Conference
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2018 |
Workflow for Developing High-resolution 3D City Models in Korea
Jo Jung Hee International Conference on Intelligent Computing and Applications (ICICA) 2018, pp.19-22 |
0 |
원문
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