Registered ULTRA WIDEBAND SYSTEM-ON-PACKAGE AND METHOD OF MANUFACTURING THE SAME

Inventors

Ju In Kwon, Lee Ho Jin, In Bok Yom

Application No.

12604354 (2009.10.22)

Publication No.

20100102425 (2010.04.29)

Registration No.

8049319 (2011.11.01)

Country

UNITED STATES

Project Code

08MR2800, Development of Satellite and Terrestrial Convergence Technology for Internet Service on High-speed Mobile Vehicles, Lee Ho Jin

Abstract

This research discloses an ultra wideband system-on-package (SoP). The SoP includes a package body; a first integrated circuit mounted on the package body; a first signal transmission unit connected to the first integrated circuit; a signal via connected to the first signal transmission unit and including a slab line and a trough line; and a second signal transmission unit connected to the signal via. The technology of the present research can transmit ultra broadband signals by minimizing discontinuity of signals appearing during vertical transition that occurs in the course of a signal transmission to/from an external circuit, and a fabrication method thereof.

KSP Keywords

Fabrication method, Signal transmission, Ultra wide band(UWB), Vertical Transition, integrated circuit(IC), system-on-package, ultra-broadband, ultra-wideband system, wideband system

Family

 

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Status	Patent	Country	KIPRIS
Registered	초광대역 시스템 온 패키지 및 그 제조 방법	KOREA	KIPRIS