등록 초광대역 시스템 온 패키지 및 그 제조 방법

초록: This research discloses an ultra wideband system-on-package (SoP). The SoP includes a package body; a first integrated circuit mounted on the package body; a first signal transmission unit connected to the first integrated circuit; a signal via connected to the first signal transmission unit and including a slab line and a trough line; and a second signal transmission unit connected to the signal via. The technology of the present research can transmit ultra broadband signals by minimizing discontinuity of signals appearing during vertical transition that occurs in the course of a signal transmission to/from an external circuit, and a fabrication method thereof.

KSP 제안 키워드: Fabrication method, Integrated circuit, Signal transmission, Ultra-Wide Band(UWB), Ultra-broadband, Vertical Transition, system-on-package, ultra-wideband system, wideband system

패밀리 특허 목록
구분	특허	출원국	KIPRIS
등록	초광대역 시스템 온 패키지 및 그 제조 방법	대한민국