Patent

Registered METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

Inventors
Application No.
16795009 (2020.02.19)
Publication No.
20200266078 (2020.08.20)
Registration No.
11488841 (2022.11.01)
Country
UNITED STATES
Project Code
19PB1700, Eco-friendly Interconnection Paste and Process with Laser Bonding for Flexible LED Module, Eom Yong Sung
19PB1100, Development of thin photovoltaic module over 25% efficiency based on micro solar cells for mobile applications, Choi Kwang-Seong
Abstract
Provided is a method for manufacturing a semiconductor package, the method including providing a semiconductor chip on a substrate, providing a bonding member between the substrate and the semiconductor chip, and bonding the semiconductor chip on the substrate by irradiating of a laser on the substrate. Here, the bonding member may include a thermosetting resin, a curing agent, and a laser absorbing agent.
KSP Keywords
Semiconductor chip, Semiconductor package, curing agent, thermosetting resin
Family
 
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Status Patent Country KIPRIS
Registered METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE UNITED STATES