Registered
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Inventors
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- Application No.
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16795009 (2020.02.19)
- Publication No.
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20200266078 (2020.08.20)
- Registration No.
- 11488841 (2022.11.01)
- Country
- UNITED STATES
- Project Code
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19PB1700, Eco-friendly Interconnection Paste and Process with Laser Bonding for Flexible LED Module,
Eom Yong Sung
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19PB1100, Development of thin photovoltaic module over 25% efficiency based on micro solar cells for mobile applications,
Choi Kwang-Seong
- Abstract
- Provided is a method for manufacturing a semiconductor package, the method including providing a semiconductor chip on a substrate, providing a bonding member between the substrate and the semiconductor chip, and bonding the semiconductor chip on the substrate by irradiating of a laser on the substrate. Here, the bonding member may include a thermosetting resin, a curing agent, and a laser absorbing agent.
- KSP Keywords
- Semiconductor chip, Semiconductor package, curing agent, thermosetting resin
- Family
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