Conference
|
2024 |
Simultaneous Transfer and Bonding (SITRAB) Technology for Integrating Micro-LEDs onto Display Backplanes
Jungho Shin
International Symposium on Microelectronics and Packaging (ISMP) 2024, pp.1-15 |
|
|
Conference
|
2024 |
Laser Assisted Bonding (LAB) based Flip-chip process for fine pitch solder bumps device using Laser Non-Conductive Paste (NCP)
Ki-Seok Jang
Electronic System-Integration Technology Conference (ESTC) 2024, pp.1-4 |
|
|
Journal
|
2024 |
Microlens Encapsulation of Thixotropic Siloxane/Silica Nanocomposites for Highly Efficient and Reliable Micro‐Light‐Emitting Diodes
Byung Jo Um, Hyungshin Kweon,
Jiho Joo
ADVANCED OPTICAL MATERIALS, v.권호미정, pp.1-9 |
0 |
|
Conference
|
2024 |
Micro-LED Bonding and Repair on Display Backplanes by Simultaneous Transfer and Bonding (SITRAB) Technology
Jungho Shin
International Meeting on Information Display (IMID) 2024, pp.1-1 |
|
|
Conference
|
2024 |
Never drying solder paste at room temperature for semiconductor packaging process
엄용성
대한전자공학회 학술 대회 (하계) 2024, pp.3344-3345 |
|
|
Conference
|
2024 |
Transfer, Bonding, and Repair of LEDs for µLED Display Fabrication via Simultaneous Transfer and Bonding (SITRAB) Technology
Jungho Shin
Society for Information Display (SID) International Symposium 2024, pp.1278-1281 |
|
|
Conference
|
2024 |
Development of a Full-Color MicroLED Display Utilizing Novel Simultaneous Transfer and Bonding (SITRAB) Process and SITRAB Film Technology
Jiho Joo
Society for Information Display (SID) International Symposium 2024, pp.1309-1312 |
|
|
Conference
|
2024 |
Transfer, bonding, repair of LEDs via simultaneous transfer and bonding (SITRAB) technology
신정호
한국마이크로전자 및 패키징학회 학술 대회 2024, pp.1-1 |
|
|
Journal
|
2024 |
Process window of simultaneous transfer and bonding materials using laser‐assisted bonding for mini‐ and micro‐LED display panel packaging
Yong-Sung Eom
ETRI Journal, v.46, no.2, pp.347-359 |
5 |
|
Conference
|
2024 |
Process window of Laser Non-Conductive Paste for Flip-chip Laser-Assisted Bonding
엄용성
한국마이크로전자 및 패키징학회 학술 대회 2024, pp.43-43 |
|
|
Conference
|
2023 |
94GHz Fan-Out Wafer-Level Packaging (FOWLP) for High-Resolution Proximity Sensors, Autonomous Driving, and 5G/6G Telecommunication Systems
Jiho Joo
International Symposium on Microelectronics and Packaging (ISMP) 2023, pp.1-23 |
|
|
Conference
|
2023 |
Process Window of Mini-LED Display Panel Packaging using Laser Assisted Bonding Technology
Yong-Sung Eom
European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 |
0 |
|
Conference
|
2023 |
Anisotropic Solder Paste (ASP) Material Solution for Laser Assisted Bonding (LAB) Process
Ki-Seok Jang
European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 |
0 |
|
Conference
|
2023 |
Highly reliable Mini-LED display module using simultaneous transfer and bonding (SITRAB) technology
Jiho Joo
International Meeting on Information Display (IMID) 2023, pp.1-1 |
|
|
Conference
|
2023 |
Laser-Assisted Bonding with Compression (LABC) based Tiling Bonding Technology, Enabling Technology for Chiplet Integration
Kwang-Seong Choi
Electronic Components and Technology Conference (ECTC) 2023, pp.1385-1389 |
3 |
|
Conference
|
2023 |
Development of a highly reliable Mini-LED display module using simultaneous transfer and bonding (SITRAB) technology
Jiho Joo
Society for Information Display (SID) International Symposium 2023, pp.433-436 |
2 |
|
Conference
|
2023 |
Development of Bonding Technology of HBM2-Level Stacked Chip with Reliability using Developed Electroplating Materials
엄용성
한국표면공학회 학술 대회 (춘계) 2023, pp.70-70 |
|
|
Conference
|
2022 |
Isosorbide-Based Organic-Inorganic Hybrid Materials for Green Chemistry
Gwang-Mun Choi
Materials Research Society (MRS) Meeting 2022 (Fall), pp.1-2 |
|
|
Conference
|
2022 |
Epoxy based Solder Paste for Flexible Substrate with Laser Assisted Bonding Process
Ki-Seok Jang
Electronic System-Integration Technology Conference (ESTC) 2022, pp.28-30 |
2 |
|
Conference
|
2022 |
Micro/Mini LED Array Transferred onto a Flexible Substrate Using Simultaneous Transfer and Bonding (SITRAB) Process and Anisotropic Solder Film (ASF)
Jiho Joo
International Meeting on Information Display (IMID) 2022, pp.1-19 |
|
|
Conference
|
2022 |
Mini LED array transferred onto a flexible substrate using Simultaneous Transfer and Bonding (SITRAB) process and Anisotropic Solder Film (ASF)
Jiho Joo
Electronic Components and Technology Conference (ECTC) 2022, pp.619-624 |
1 |
|
Conference
|
2022 |
Development of Flexible full-color Mini-LED display using simultaneous transfer and bonding (SITRAB) technology
주지호
대한전자공학회 학술 대회 (하계) 2022, pp.1-2 |
|
|
Conference
|
2022 |
Interconnection Reliability of Mini LEDs for Display Applications
In-Seok Kye
Electronic Components and Technology Conference (ECTC) 2022, pp.1184-20 |
0 |
|
Conference
|
2022 |
74‐4: Development of Flexible Full‐Color Mini‐LED Display Using Simultaneous Transfer and Bonding (SITRAB) Technology
Jiho Joo
Society for Information Display (SID) International Symposium 2022, pp.1005-1008 |
13 |
|
Conference
|
2022 |
Laser-Assisted Bonding (LAB) Process and its Bonding Materials as Technologies enabling the Low-Carbon Era
Kwang-Seong Choi
Electronic Components and Technology Conference (ECTC) 2022, pp.196-203 |
4 |
|
Conference
|
2022 |
Interconnection Reliability Analysis of Mini-LEDs for Display Applications
In-Seok Kye
대한용접접합학회 학술 발표 대회 (춘계) 2022, pp.1-19 |
|
|
Conference
|
2022 |
Evaluation of Solder Wetting and Screen-Printing with Dry-Free Solder Paste
장기석
대한용접접합학회 학술 발표 대회 (춘계) 2022, pp.1-13 |
|
|
Conference
|
2022 |
Development of Mini-LED display using simultaneous transfer and bonding (SITRAB) technology
주지호
한국마이크로전자 및 패키징학회 학술 대회 2022, pp.1-2 |
|
|
Conference
|
2022 |
Dry-Free Solder Paste with No Viscosity change at R.T. & No Adhesion change after Screen-Printing Process
장기석
한국마이크로전자 및 패키징학회 학술 대회 2022, pp.1-1 |
|
|
Journal
|
2022 |
MicroLED Transfer, Bonding, and Bad Pixel Repair Technology
최광성
전자통신동향분석, v.37, no.2, pp.53-61 |
|
|
Conference
|
2022 |
Comparison of mini-LED bonding using ACF(Anisotropic conductive film) and ASF(Anisotropic solder film)
이찬미
한국마이크로전자 및 패키징학회 학술 대회 2022, pp.1-2 |
|
|
Conference
|
2021 |
Simultaneous Transfer and Bonding (SITRAB) Process for Micro-LEDs Using Laser-Assisted Bonding with Compression (LABC) Process and SITRAB Adhesive
Kwang-Seong Choi
Electronic Components and Technology Conference (ECTC) 2021, pp.1607-1613 |
11 |
|
Conference
|
2021 |
Development of simultaneous transferring and bonding (SITRAB) process for µLED arrays using Anisotropic Solder Paste (ASP) and Laser-Assisted Bonding (LAB) Technology
Jiho Joo
Electronic Components and Technology Conference (ECTC) 2021, pp.687-692 |
5 |
|
Conference
|
2021 |
59‐5: Simultaneous Transfer and Bonding (SITRAB) Process for Mini‐LED Display
Kwang-Seong Choi
Society for Information Display (SID) International Symposium 2021, pp.841-844 |
5 |
|
Journal
|
2021 |
Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining
Gwang-Mun Choi
Polymers, v.13, no.6, pp.1-14 |
10 |
|
Conference
|
2020 |
Study on Epoxy-Solder Hybrid Underfill Material for Fine-Pitch Bonding Application
최광문
한국마이크로전자 및 패키징학회 학술 대회 2020, pp.1-1 |
|
|
Conference
|
2020 |
Low fume and No-cleaning Solder Wire Technology
장기석
한국마이크로전자 및 패키징학회 2020, pp.1-1 |
|
|
Conference
|
2020 |
Development of LAB-based low thermal deformation bonding technology for PCT substrates that are vulnerable to thermal processes
이찬미
한국마이크로전자 및 패키징학회 학술 대회 2020, pp.1-14 |
|
|
Conference
|
2020 |
Development of film-based ultra-compact GaAs photovoltaic module using Laser-Assisted Bonding
Jiho Joo
European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC) 2020, pp.1-1 |
|
|
Journal
|
2020 |
Epoxy-based Interconnection Materials and Process Technology Trends for Semiconductor Packaging
엄용성
전자통신동향분석, v.35, no.4, pp.1-10 |
|
|
Conference
|
2020 |
Development of Digital Signage Modules composed of Mini-LEDs using Laser-Assisted Bonding (LAB) Technology
Kwang-Seong Choi
Electronic Components and Technology Conference (ECTC) 2020, pp.1031-1036 |
9 |
|
Conference
|
2020 |
Development of bonding process for flexible devices with fine-pitch interconnection using Anisotropic Solder Paste and Laser-Assisted Bonding Technology
Jiho Joo
Electronic Components and Technology Conference (ECTC) 2020, pp.1309-1314 |
11 |
|
Journal
|
2020 |
Self-Powered Autonomous Wireless Sensor Node by Using Silicon-Based 3D Thermoelectric Energy Generator for Environmental Monitoring Application
Jong-Pil Im
Energies, v.13, no.3, pp.1-17 |
16 |
|
Journal
|
2019 |
Conductive adhesive with transient liquid‐phase sintering technology for high‐power device applications
Yong-Sung Eom
ETRI Journal, v.41, no.6, pp.820-828 |
7 |
|
Conference
|
2019 |
Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration
Kwang-Seong Choi
International 3D Systems Integration Conference (3DIC) 2019, pp.1-3 |
2 |
|
Conference
|
2019 |
Advanced Interconnection technology with Laser Assisted Bonding Process for PET Substrate
Yong-Sung Eom
European Microelectronics and Packaging Conference (EMPC) 2019, pp.1-5 |
0 |
|
Conference
|
2019 |
Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology
Kwang-Seong Choi
Electronic Components and Technology Conference (ECTC) 2019, pp.197-203 |
19 |
|
Journal
|
2018 |
Laser-Assisted Bonding Technology for Interconnections of Multidimensional Heterogeneous Devices
최광성
전자통신동향분석, v.33, no.6, pp.50-57 |
|
|
Conference
|
2018 |
Thermal Analysis of SiC Power Semiconductor with Copper Clip Bonding and Copper Sintering Paste
In-Hoo Kim
International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 2018, pp.1-4 |
|
|
Journal
|
2018 |
Synchronous curable deoxidizing capability of epoxy–anhydride adhesive: Deoxidation quantification via spectroscopic analysis
Keon-Soo Jang
Journal of Applied Polymer Science, v.135, no.33, pp.1-9 |
16 |
|
Journal
|
2018 |
Crosslinkable deoxidizing hybrid adhesive of epoxy–diacid for electrical interconnections in semiconductor packaging
Keon-Soo Jang
Polymer International, v.67, no.9, pp.1241-1247 |
19 |
|
Conference
|
2018 |
Interconnection Process using Laser and Hybrid Underfill for LED Array Module on PET Substrate
Kwang-Seong Choi
Electronic Components and Technology Conference (ECTC) 2018, pp.1561-1567 |
15 |
|
Journal
|
2018 |
Versatile Epoxy/Phenoxy/Anhydride-Based Hybrid Adhesive Films for Deoxidization and Electrical Interconnection
Keon-Soo Jang
Industrial & Engineering Chemistry Research, v.57, no.21, pp.7181-7187 |
11 |
|
Conference
|
2018 |
Quantifying Fluxing Capability of NCP and NCF
장건수
한국마이크로전자 및 패키징학회 학술 대회 (춘계) 2018, pp.33-33 |
|
|
Journal
|
2017 |
Hidden Innovations in the Fourth Industrial Revolution: Electronic Packaging Technology
최광성
전자통신동향분석, v.32, no.6, pp.17-26 |
|
|
Conference
|
2017 |
Silica Filler Content in NCP and its Effects on the Reliability of 3D TSV Multi-Stack under Thermal Shock Test
Wagno Alves Braganca Junior
Electronics Packaging Technology Conference (EPTC) 2017, pp.1-8 |
7 |
|
Conference
|
2017 |
Development of Stacking Process for 3D TSV (Through Silicon Via) Structure using Laser
Kwang-Seong Choi
International Microelectronics Assembly and Packaging Society (IMAPS) 2017, pp.1-5 |
|
|
Conference
|
2017 |
Micro Thermoelectric Cooler for Optical Transmitter using Silicon Substrate
Hyun-cheol Bae
International Conference on Advanced Electromaterials (ICAE) 2017, pp.1-1 |
|
|
Conference
|
2017 |
Low-temperature Sintering Behavior of Ternary Solder and Copper Powder for High-Power Device Packaging
Yong-Sung EOM
European Microelectronics and Packaging Conference (EMPC) 2017, pp.1-4 |
0 |
|
Conference
|
2017 |
Solvent-free Fluxing Underfill Film for Electrical Interconnection
Keon-Soo Jang
European Microelectronics and Packaging Conference (EMPC) 2017, pp.1-4 |
3 |
|
Conference
|
2017 |
Power Device Packaging for Electric Vehicle
배현철
대한전자공학회 종합 학술 대회 (하계) 2017, pp.1663-1664 |
|
|
Conference
|
2017 |
Micro Thermoelectric Cooler for Optical Transmitter
배현철
한국마이크로전자 및 패키징학회 학술 대회 (춘계) 2017, pp.38-38 |
|
|
Journal
|
2016 |
Curing Kinetics and Chemorheological Behavior of No-flow Underfill for Sn/In/Bi Solder in Flexible Packaging Applications
Eom Yong-Sung
ETRI Journal, v.38, no.6, pp.1179-1189 |
4 |
|
Journal
|
2016 |
Thermoelectric Cooler Module with Enhanced Cooling Ability Using a Hybrid Cu Paste and a Si Substrate
Hyun-Cheol Bae
Journal of Nanoscience and Nanotechnology, v.16, no.12, pp.12732-12736 |
2 |
|
Journal
|
2016 |
Sn58Bi Solder Interconnection for Low-Temperature Flex-on-Flex Bonding
Haksun Lee
ETRI Journal, v.38, no.6, pp.1163-1171 |
13 |
|
Conference
|
2016 |
Thermal and Electrical Designs of RF 3D Module Based on Si Interposers with Redundant TSVs
Kwang-Seong Choi
Electronic Components and Technology Conference (ECTC) 2016, pp.2051-2057 |
2 |
|
Conference
|
2016 |
Analysis of Bond Pull Test using Al Ultrasonic Bonding Process
오애선
대한전자공학회 종합 학술 대회 (하계) 2016, pp.1-3 |
|
|
Journal
|
2016 |
Characterization of Transmission Lines with Through-silicon-vias and Bump Joints on High-resistivity Si Interposers for RF Three-dimensional Modules
Kwang-Seong Choi
Japanese Journal of Applied Physics, v.55, no.6S3, pp.1-5 |
2 |
|
Conference
|
2015 |
Characterization of Hybrid Underfill for Low-Temperature Process Applicable to Flexible Substrate
Jihye Son
Electronics Packaging Technology Conference (EPTC) 2015, pp.1-4 |
0 |
|
Conference
|
2015 |
High Performance Thermoelectric Cooler Module Using Hybrid Cu Paste and Si Substrate
Hyun-Cheol Bae
International Conference on Advanced Electromaterials (ICAE) 2015, pp.1-1 |
|
|
Conference
|
2015 |
Cost-Effective Thermoelectric Cooler Module Using Isotropic Conductive Paste Based on Epoxy with Ag Coated Cu and Solder
Hyun-Cheol Bae
International Symposium on Microelectronics and Packaging (ISMP) 2015, pp.136-136 |
|
|
Conference
|
2015 |
Electrically Conductive Paste with Copper for Flexible Packaging Application
Yong-Sung EOM
International Symposium on Microelectronics and Packaging (ISMP) 2015, pp.144-144 |
|
|
Conference
|
2015 |
Design and Fabrication of Thermoelectric Generator Based on BiTe Legs
S. E. Moon
IUMRS International Conference on Advanced Materials (IUMRS-ICAM) 2015, pp.1-1 |
|
|
Conference
|
2015 |
Cost-Effective Thermoelectric Cooler Packaging Using Hybrid Cu Paste
Hyun-Cheol Bae
European Microelectronics and Packaging Conference (EMPC) 2015, pp.1-4 |
|
|
Conference
|
2015 |
Isotropic Conductive Paste Based on Epoxy with Ag Coated Cu and SAC305 Solder
Yong-Sung EOM
European Microelectronics and Packaging Conference (EMPC) 2015, pp.1-5 |
|
|
Journal
|
2015 |
Epoxy Solder Paste and Its Applications
문종태
대한용접·접합학회지, v.33, no.3, pp.32-39 |
|
|
Journal
|
2015 |
Novel Low-Volume Solder-on-Pad Process for Fine Pitch Cu Pillar Bump Interconnection
Hyun-Cheol Bae
한국마이크로전자 및 패키징학회지, v.22, no.2, pp.55-59 |
|
|
Conference
|
2015 |
Thermoelectric Cooler Module using Hybrid Cu Paste
배현철
한국전기전자재료학회 학술 대회 (하계) 2015, pp.1-1 |
|
|
Conference
|
2015 |
Isotropic Conductive Paste with Copper Powder for Flexible Thermoelectric Device
엄용성
한국전기전자재료학회 학술 대회 (하계) 2015, pp.1-1 |
|
|
Conference
|
2015 |
Characterization of 3D Stacked High Resistivity Si Interposers with Polymer TSV Liners for 3D RF Module
Kwang-Seong Choi
Electronic Components and Technology Conference (ECTC) 2015, pp.928-933 |
4 |
|
Conference
|
2015 |
미세피치를 위한 Solder-on-Pad 공정 및 높이 예측
이학선
한국마이크로전자 및 패키징학회 학술 대회 (춘계) 2015, pp.1-1 |
|
|
Conference
|
2015 |
Hybrid Cu Paste를 적용한 열전 소자 모듈
배현철
한국마이크로전자 및 패키징학회 학술 대회 (춘계) 2015, pp.18-18 |
|
|
Conference
|
2015 |
Development of High-Resistivity Si Interposer for 3D RF Module
최광성
한국마이크로전자 및 패키징학회 학술 대회 (춘계) 2015, pp.9-9 |
|
|
Journal
|
2015 |
Interconnection Technology Based on InSn Solder for Flexible Display Applications
Kwang-Seong Choi
ETRI Journal, v.37, no.2, pp.387-394 |
13 |
|
Conference
|
2015 |
Maskless Screen Printing Technology using Solder Bump Maker (SBM) for Flexible Electronics
Kwang-Seong Choi
International Conference on Electronics Packaging & iMAPS All Asia Conference (ICEP & IAAC) 2015, pp.276-291 |
|
|
Journal
|
2015 |
Development of Copper Electro-Plating Technology on a Screen-Printed Conductive Pattern with Copper Paste
Yong-Sung Eom
한국마이크로전자 및 패키징학회지, v.22, no.1, pp.51-54 |
|
|
Conference
|
2014 |
Development of Fluxing Underfill for Sn/27In/54Bi Solder with Melting Temperature of 83℃
정이슬
한국마이크로전자 및 패키징학회 학술 대회 2014, pp.1-1 |
|
|
Conference
|
2014 |
Non-Destructive Inspection of 3D stacked TSV Module Using X-ray Computed Tomography
배현철
한국마이크로전자 및 패키징학회 학술 대회 2014, pp.1-1 |
|
|
Conference
|
2014 |
Shear Strength Analysis of Hybrid Cu Paste for Thermoelectric Device Module
오애선
한국마이크로전자 및 패키징학회 학술 대회 2014, pp.1-1 |
|
|
Conference
|
2014 |
Study of Process Development for HU with a High Thixotropy
손지혜
한국마이크로전자 및 패키징학회 학술 대회 2014, pp.1-1 |
|
|
Journal
|
2014 |
Characterization and Estimation of Solder-on-Pad Process for Fine-Pitch Applications
Haksun Lee
IEEE Transactions on Components, Packaging, and Manufacturing Technology, v.4, no.10, pp.1729-1738 |
14 |
|
Conference
|
2014 |
Flip-Chip Bonding Processes with Low Volume SoP Technology
Yong-Sung EOM
Electronic System-Integration Technology Conference (ESTC) 2014, pp.1-4 |
0 |
|
Conference
|
2014 |
Development of Low Contact Resistance Interconnection for Display Applications
Haksun Lee
Electronic System-Integration Technology Conference (ESTC) 2014, pp.1-5 |
4 |
|
Journal
|
2014 |
Characterization of Fluxing and Hybrid Underfills with Micro-encapsulated Catalyst for Long Pot Life
Yong-Sung Eom
ETRI Journal, v.36, no.3, pp.343-351 |
35 |
|
Conference
|
2014 |
Maskless Screen Printing Technology for 20μm-Pitch, 52InSn Solder Interconnections in Display Applications
Kwang-Seong Choi
Electronic Components and Technology Conference (ECTC) 2014, pp.1154-1159 |
8 |
|
Journal
|
2013 |
Fine‐Pitch Solder on Pad Process for Microbump Interconnection
Hyun-Cheol Bae
ETRI Journal, v.35, no.6, pp.1152-1155 |
22 |
|
Journal
|
2013 |
Recent Trends of Flip Chip Bonding Technology
최광성
전자통신동향분석, v.28, no.5, pp.100-110 |
|
|
Conference
|
2013 |
Novel Low-Volume Solder-on-Pad for Fine-Pitch Cu Pillar Bump
Hyun-Cheol Bae
European Microelectronics and Packaging Conference (EMPC) 2013, pp.1-4 |
|
|
Conference
|
2013 |
Novel Interconnection Technology for Flex-on-Glass (FOG) Applications
Haksun Lee
European Microelectronics and Packaging Conference (EMPC) 2013, pp.1-5 |
|
|
Conference
|
2013 |
Thermally Activated Bumping Process using Sn3.0Ag0.5Cu Solder Powder for Low-Cost Interposers
Kwang-Seong Choi
International Symposium on Microelectronics (IMAPS) 2013, pp.420-423 |
0 |
|
Journal
|
2013 |
Optimization of Material and Process for Fine Pitch LVSoP Technology
Yong-Sung Eom
ETRI Journal, v.35, no.4, pp.625-631 |
21 |
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Conference
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2013 |
Epoxy Copper Paste as an Isotropic Conductive Adhesive
Yong-Sung EOM
International Conference on Electronics Packaging (ICEP) 2013, pp.507-510 |
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Journal
|
2013 |
Novel Bumping Process for Solder on Pad Technology
Kwang-Seong Choi
ETRI Journal, v.35, no.2, pp.340-343 |
23 |
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Conference
|
2012 |
Fine-Pitch, Low-Volume SoP(Solder-on-Pad) Process
Ho-Eun Bae
Electronics Packaging Technology Conference (EPTC) 2012, pp.723-727 |
2 |
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Conference
|
2012 |
Novel Solder-on-Pad (SoP) Material and Process for Low-Cost Interposers
Kwang-Seong Choi
Annual Global Interposer Technology Workshop (GIT) 2012, pp.1-2 |
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Journal
|
2012 |
Novel Bumping and Underfill Technologies for 3D IC integration
Ki-Jun Sung
ETRI Journal, v.34, no.5, pp.706-712 |
30 |
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Conference
|
2012 |
3D SiP Module Using TSV and Novel Low-Volume Solder-on-Pad(SoP) Process
Hyun-Cheol Bae
Electronic System-Integration Technology Conference (ESTC) 2012, pp.1-4 |
1 |
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Conference
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2012 |
Novel Low-Volume Solder-on-Pad (SoP) Material and Process for Flip Chip Bonding Using Au Stud Bumps
Kwang-Seong Choi
Electronic Components and Technology Conference (ECTC) 2012, pp.1919-1924 |
1 |
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Journal
|
2012 |
Technical Trends of Interposers for 2.5D Integration
최광성
전자통신동향분석, v.27, no.1, pp.51-60 |
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Conference
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2011 |
SoP(Solder on Pad) Technology with SBM(Solder Bump Maker) Material
노정현
한국마이크로전자 및 패키징학회 학술 대회 (추계) 2011, pp.1-1 |
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Conference
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2011 |
Low-volume Solder-on-Pad Technology for 3D IC Integration
배호은
한국마이크로전자 및 패키징학회 학술 대회 (추계) 2011, pp.1-1 |
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Conference
|
2011 |
Chip-to-chip Bonding용 Fluxing Underfill 개발
전수정
한국마이크로전자 및 패키징학회 학술 대회 (추계) 2011, pp.1-1 |
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Journal
|
2011 |
Novel Bumping Material for Solder-on-Pad Technology
Kwang-Seong Choi
ETRI Journal, v.33, no.4, pp.637-640 |
31 |
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Conference
|
2011 |
Bumping and Stacking Processes for 3D IC using Fluxfree Polymer
Kwang-Seong Choi
Electronic Components and Technology Conference (ECTC) 2011, pp.1746-1751 |
3 |
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Journal
|
2010 |
Chemo-Rheological Characteristics of a Self-Assembling Anisotropic Conductive Adhesive System Containing a Low-Melting Point Solder
Ji-Won Baek
Microelectronic Engineering, v.87, no.10, pp.1968-1972 |
31 |
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Journal
|
2010 |
3D IC Using through Silicon via Technologies
최광성
전자통신동향분석, v.25, no.5, pp.97-105 |
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Conference
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2010 |
Solder Bump Maker with Coining Process on TSV Chips for 3D Packages
Ki-Jun Sung
International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP) 2010, pp.185-189 |
3 |
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Conference
|
2010 |
Novel Solder-on-Pad (SoP) Technology for Fine-Pitch Flip Chip Bonding
Kwang-Seong Choi
International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP) 2010, pp.805-805 |
3 |
|
Journal
|
2010 |
Electrical Interconnection with a Smart ACA Composed of Fluxing Polymer and Solder Powder
Yong-Sung Eom
ETRI Journal, v.32, no.3, pp.414-421 |
51 |
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Conference
|
2010 |
Optimized TSV Process using Bottom-up Electroplating without Wafer Cracks
Byeong-Ok Lim
Electronic Components and Technology Conference (ECTC) 2010, pp.1642-1646 |
6 |
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Conference
|
2010 |
3D SiP Module using TSV and Novel Solder Bump Maker
Hyun-Cheol Bae
Electronic Components and Technology Conference (ECTC) 2010, pp.1637-1641 |
5 |
|
Journal
|
2010 |
Novel Maskless Bumping for 3D Integration
Kwang-Seong Choi
ETRI Journal, v.32, no.2, pp.342-344 |
37 |
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Journal
|
2009 |
Catalytic Behavior of Sn/Bi Metal Powder in Anhydride-Based Epoxy Curing
Keon Soo Jang
Journal of Nanoscience and Nanotechnology, v.9, no.12, pp.7461-7466 |
31 |
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Conference
|
2009 |
Novel Bumping Material for Stacking Silicon Chips
Kwang Seong Choi
Electronics Packaging Technology Conference (EPTC) 2009, pp.579-583 |
2 |
|
Journal
|
2009 |
Development of High-Quality LTCC Solenoid Inductor using Solder Ball and Air Cavity for 3-D SiP
Hyun-Cheol Bae
한국마이크로전자 및 패키징학회지, v.46, no.4, pp.5-8 |
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Conference
|
2009 |
산화막 제거 기능이 있는 플럭싱 고분자 수지의 공정 특성 연구
이종진
한국마이크로전자 및 패키징학회 학술 대회 (추계) 2009, pp.1-1 |
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Journal
|
2009 |
Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)
Byung Seung Yim
Materials Transactions, v.50, no.7, pp.1684-1689 |
6 |
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Journal
|
2009 |
Design and Fabrication of 1.25-Gb/s Full-Triplex Transceiver Module With PLC on a Lossy Si Substrate for G/E-PONs
Sung Il Kim
Journal of Lightwave Technology, v.27, no.6, pp.679-687 |
0 |
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Journal
|
2008 |
Electrical and Mechanical Characterization of an Anisotropic Conductive Adhesive with a Low Melting Point Solder
Yong-Sung Eom
Microelectronic Engineering, v.85, no.11, pp.2202-2206 |
32 |
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Journal
|
2008 |
3D SiP(System-in-Package) 기술 동향
최광성
주간기술동향, v.1367, pp.14-27 |
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Conference
|
2008 |
Thermal Latent Catalytic Behavior of a Sn/Bi Metal Powder in Thermosetting Materials
Keon Soo Jang
International Conference on Nanoscale Materials and Engineering (ICNME) 2008, pp.1-1 |
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Journal
|
2008 |
Characterization of Polymer Matrix and Low Melting Point Solder for Anisotropic Conductive Film
Yong-Sung Eom
Microelectronic Engineering, v.85, no.2, pp.327-331 |
64 |
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Conference
|
2007 |
저융점 솔더를 사용한 이방성 도전 접속제 (ACF) 연구
엄용성
한국재료학회 학술 발표회 (춘계) 2007, pp.12-12 |
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Conference
|
2007 |
저융점 솔더를 사용한 이방성 도전 접속제의 전기 기계적 특성 연구
엄용성
한국고분자학회 학술 대회 (춘계) 2007, pp.65-65 |
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Conference
|
2006 |
Development of Optical Components for the Access Network
백용순
광자기술 학술 회의 (PC) 2006, pp.1-2 |
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Conference
|
2006 |
1.25Gbps Optical Triplexer Module with Planar Lightwave Circuit
Yong Sung Eom
International Symposium on Microelectronics (IMAPS) 2006, pp.1319-1323 |
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Conference
|
2006 |
Polymeric Variable Optical Attenuator based on Surface Plasmon Polariton
Sun Tak Park
Photonics Europe, pp.1-7 |
0 |
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Conference
|
2006 |
1.25Gbps Optical Triplexer Module using Planar Lightwave Circuit
엄용성
한국반도체 학술 대회 (KCS) 2006, pp.1-2 |
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Conference
|
2004 |
반도체광전치증폭기가 집적된10Gb/s 마흐-젠더 파장변환기의 동적 입력 파워 범위의 증가
Hyun-Soo Kim
Optoelectronics and Communications Conference (OECC) 2004, pp.380-381 |
|
|
Conference
|
2004 |
10 Gb/s All-Optical Mach-Zehnder Interferometric Wavelength Converter module with Monolithically integrated SOA preamplifiers.
김현수
COOC04, pp.193-194 |
|
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Conference
|
2003 |
Electrical crosstalk analysis for gigabit optical transceiver module
Sung-IL Kim
Pacific Rim Conference on Lasers and Electro-Optics (CLEO-PR) 2003, pp.572-572 |
3 |
|
Journal
|
2003 |
Fabrications and characteristics of XPM based wavelength converter module with monolithically integrated SOA’s
김종회
한국광학회지, v.14, no.5, pp.509-514 |
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Conference
|
2003 |
Packaging technology for wavelength tunable filter based on optical MEMS
Yong-Sung Eom
IEEE LEOS International Conference on Optical MEMS 2003, pp.67-68 |
0 |
|
Conference
|
2003 |
Optical design of tunable Ld module
최병석
광전자 및 광통신 학술 회의 (COOC) 2003, pp.535-536 |
|
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Conference
|
2003 |
Optical Design for 2D-MOEMS Switch Packaging
엄용성
광전자 및 광통신 학술 회의 (COOC) 2003, pp.437-378 |
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Conference
|
2003 |
Mach-Zehnder interferometric wavelength converter with monolithically integrated semiconductor optical amplifiers for 40nm span
김종회
광전자 및 광통신 학술 회의 (COOC) 2003, pp.1-2 |
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Conference
|
2002 |
Fabrication and measurement of waveguide photodiodes for 40 Gbps optical receiver
권용환
Photonics Conference 2002, pp.85-86 |
|
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Conference
|
2002 |
Fabrication of 50GHz internal wavelength locker module for multi-channel tunable laser diodes in DWDM applications
박흥우
Photonics Conference 2002, pp.13-14 |
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