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Eom Yong Sung
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Type Year Title Cited Download
Conference
2024 Simultaneous Transfer and Bonding (SITRAB) Technology for Integrating Micro-LEDs onto Display Backplanes   Jungho Shin   International Symposium on Microelectronics and Packaging (ISMP) 2024, pp.1-15
Conference
2024 Laser Assisted Bonding (LAB) based Flip-chip process for fine pitch solder bumps device using Laser Non-Conductive Paste (NCP)   Ki-Seok Jang   Electronic System-Integration Technology Conference (ESTC) 2024, pp.1-4
Journal
2024 Microlens Encapsulation of Thixotropic Siloxane/Silica Nanocomposites for Highly Efficient and Reliable Micro‐Light‐Emitting Diodes   Byung Jo Um, Hyungshin Kweon, Jiho Joo   ADVANCED OPTICAL MATERIALS, v.권호미정, pp.1-9 0
Conference
2024 Micro-LED Bonding and Repair on Display Backplanes by Simultaneous Transfer and Bonding (SITRAB) Technology   Jungho Shin   International Meeting on Information Display (IMID) 2024, pp.1-1
Conference
2024 Never drying solder paste at room temperature for semiconductor packaging process   엄용성   대한전자공학회 학술 대회 (하계) 2024, pp.3344-3345
Conference
2024 Transfer, Bonding, and Repair of LEDs for µLED Display Fabrication via Simultaneous Transfer and Bonding (SITRAB) Technology   Jungho Shin   Society for Information Display (SID) International Symposium 2024, pp.1278-1281
Conference
2024 Development of a Full-Color MicroLED Display Utilizing Novel Simultaneous Transfer and Bonding (SITRAB) Process and SITRAB Film Technology   Jiho Joo   Society for Information Display (SID) International Symposium 2024, pp.1309-1312
Conference
2024 Transfer, bonding, repair of LEDs via simultaneous transfer and bonding (SITRAB) technology   신정호   한국마이크로전자 및 패키징학회 학술 대회 2024, pp.1-1
Journal
2024 Process window of simultaneous transfer and bonding materials using laser‐assisted bonding for mini‐ and micro‐LED display panel packaging   Yong-Sung Eom   ETRI Journal, v.46, no.2, pp.347-359 5
Conference
2024 Process window of Laser Non-Conductive Paste for Flip-chip Laser-Assisted Bonding   엄용성   한국마이크로전자 및 패키징학회 학술 대회 2024, pp.43-43
Conference
2023 94GHz Fan-Out Wafer-Level Packaging (FOWLP) for High-Resolution Proximity Sensors, Autonomous Driving, and 5G/6G Telecommunication Systems   Jiho Joo   International Symposium on Microelectronics and Packaging (ISMP) 2023, pp.1-23
Conference
2023 Process Window of Mini-LED Display Panel Packaging using Laser Assisted Bonding Technology   Yong-Sung Eom   European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 0
Conference
2023 Anisotropic Solder Paste (ASP) Material Solution for Laser Assisted Bonding (LAB) Process   Ki-Seok Jang   European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 0
Conference
2023 Highly reliable Mini-LED display module using simultaneous transfer and bonding (SITRAB) technology   Jiho Joo   International Meeting on Information Display (IMID) 2023, pp.1-1
Conference
2023 Laser-Assisted Bonding with Compression (LABC) based Tiling Bonding Technology, Enabling Technology for Chiplet Integration   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2023, pp.1385-1389 3
Conference
2023 Development of a highly reliable Mini-LED display module using simultaneous transfer and bonding (SITRAB) technology   Jiho Joo   Society for Information Display (SID) International Symposium 2023, pp.433-436 2
Conference
2023 Development of Bonding Technology of HBM2-Level Stacked Chip with Reliability using Developed Electroplating Materials   엄용성   한국표면공학회 학술 대회 (춘계) 2023, pp.70-70
Conference
2022 Isosorbide-Based Organic-Inorganic Hybrid Materials for Green Chemistry   Gwang-Mun Choi   Materials Research Society (MRS) Meeting 2022 (Fall), pp.1-2
Conference
2022 Epoxy based Solder Paste for Flexible Substrate with Laser Assisted Bonding Process   Ki-Seok Jang   Electronic System-Integration Technology Conference (ESTC) 2022, pp.28-30 2
Conference
2022 Micro/Mini LED Array Transferred onto a Flexible Substrate Using Simultaneous Transfer and Bonding (SITRAB) Process and Anisotropic Solder Film (ASF)   Jiho Joo   International Meeting on Information Display (IMID) 2022, pp.1-19
Conference
2022 Mini LED array transferred onto a flexible substrate using Simultaneous Transfer and Bonding (SITRAB) process and Anisotropic Solder Film (ASF)   Jiho Joo   Electronic Components and Technology Conference (ECTC) 2022, pp.619-624 1
Conference
2022 Development of Flexible full-color Mini-LED display using simultaneous transfer and bonding (SITRAB) technology   주지호   대한전자공학회 학술 대회 (하계) 2022, pp.1-2
Conference
2022 Interconnection Reliability of Mini LEDs for Display Applications   In-Seok Kye   Electronic Components and Technology Conference (ECTC) 2022, pp.1184-20 0
Conference
2022 74‐4: Development of Flexible Full‐Color Mini‐LED Display Using Simultaneous Transfer and Bonding (SITRAB) Technology   Jiho Joo   Society for Information Display (SID) International Symposium 2022, pp.1005-1008 13
Conference
2022 Laser-Assisted Bonding (LAB) Process and its Bonding Materials as Technologies enabling the Low-Carbon Era   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2022, pp.196-203 4
Conference
2022 Interconnection Reliability Analysis of Mini-LEDs for Display Applications   In-Seok Kye   대한용접접합학회 학술 발표 대회 (춘계) 2022, pp.1-19
Conference
2022 Evaluation of Solder Wetting and Screen-Printing with Dry-Free Solder Paste   장기석   대한용접접합학회 학술 발표 대회 (춘계) 2022, pp.1-13
Conference
2022 Development of Mini-LED display using simultaneous transfer and bonding (SITRAB) technology   주지호   한국마이크로전자 및 패키징학회 학술 대회 2022, pp.1-2
Conference
2022 Dry-Free Solder Paste with No Viscosity change at R.T. & No Adhesion change after Screen-Printing Process   장기석   한국마이크로전자 및 패키징학회 학술 대회 2022, pp.1-1
Journal
2022 MicroLED Transfer, Bonding, and Bad Pixel Repair Technology   최광성   전자통신동향분석, v.37, no.2, pp.53-61
Conference
2022 Comparison of mini-LED bonding using ACF(Anisotropic conductive film) and ASF(Anisotropic solder film)   이찬미   한국마이크로전자 및 패키징학회 학술 대회 2022, pp.1-2
Conference
2021 Simultaneous Transfer and Bonding (SITRAB) Process for Micro-LEDs Using Laser-Assisted Bonding with Compression (LABC) Process and SITRAB Adhesive   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2021, pp.1607-1613 11
Conference
2021 Development of simultaneous transferring and bonding (SITRAB) process for µLED arrays using Anisotropic Solder Paste (ASP) and Laser-Assisted Bonding (LAB) Technology   Jiho Joo   Electronic Components and Technology Conference (ECTC) 2021, pp.687-692 5
Conference
2021 59‐5: Simultaneous Transfer and Bonding (SITRAB) Process for Mini‐LED Display   Kwang-Seong Choi   Society for Information Display (SID) International Symposium 2021, pp.841-844 5
Journal
2021 Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining   Gwang-Mun Choi   Polymers, v.13, no.6, pp.1-14 10
Conference
2020 Study on Epoxy-Solder Hybrid Underfill Material for Fine-Pitch Bonding Application   최광문   한국마이크로전자 및 패키징학회 학술 대회 2020, pp.1-1
Conference
2020 Low fume and No-cleaning Solder Wire Technology   장기석   한국마이크로전자 및 패키징학회 2020, pp.1-1
Conference
2020 Development of LAB-based low thermal deformation bonding technology for PCT substrates that are vulnerable to thermal processes   이찬미   한국마이크로전자 및 패키징학회 학술 대회 2020, pp.1-14
Conference
2020 Development of film-based ultra-compact GaAs photovoltaic module using Laser-Assisted Bonding   Jiho Joo   European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC) 2020, pp.1-1
Journal
2020 Epoxy-based Interconnection Materials and Process Technology Trends for Semiconductor Packaging   엄용성   전자통신동향분석, v.35, no.4, pp.1-10
Conference
2020 Development of Digital Signage Modules composed of Mini-LEDs using Laser-Assisted Bonding (LAB) Technology   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2020, pp.1031-1036 9
Conference
2020 Development of bonding process for flexible devices with fine-pitch interconnection using Anisotropic Solder Paste and Laser-Assisted Bonding Technology   Jiho Joo   Electronic Components and Technology Conference (ECTC) 2020, pp.1309-1314 11
Journal
2020 Self-Powered Autonomous Wireless Sensor Node by Using Silicon-Based 3D Thermoelectric Energy Generator for Environmental Monitoring Application   Jong-Pil Im   Energies, v.13, no.3, pp.1-17 16
Journal
2019 Conductive adhesive with transient liquid‐phase sintering technology for high‐power device applications   Yong-Sung Eom   ETRI Journal, v.41, no.6, pp.820-828 7
Conference
2019 Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration   Kwang-Seong Choi   International 3D Systems Integration Conference (3DIC) 2019, pp.1-3 2
Conference
2019 Advanced Interconnection technology with Laser Assisted Bonding Process for PET Substrate   Yong-Sung Eom   European Microelectronics and Packaging Conference (EMPC) 2019, pp.1-5 0
Conference
2019 Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2019, pp.197-203 19
Journal
2018 Laser-Assisted Bonding Technology for Interconnections of Multidimensional Heterogeneous Devices   최광성   전자통신동향분석, v.33, no.6, pp.50-57
Conference
2018 Thermal Analysis of SiC Power Semiconductor with Copper Clip Bonding and Copper Sintering Paste   In-Hoo Kim   International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 2018, pp.1-4
Journal
2018 Synchronous curable deoxidizing capability of epoxy–anhydride adhesive: Deoxidation quantification via spectroscopic analysis   Keon-Soo Jang   Journal of Applied Polymer Science, v.135, no.33, pp.1-9 16
Journal
2018 Crosslinkable deoxidizing hybrid adhesive of epoxy–diacid for electrical interconnections in semiconductor packaging   Keon-Soo Jang   Polymer International, v.67, no.9, pp.1241-1247 19
Conference
2018 Interconnection Process using Laser and Hybrid Underfill for LED Array Module on PET Substrate   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2018, pp.1561-1567 15
Journal
2018 Versatile Epoxy/Phenoxy/Anhydride-Based Hybrid Adhesive Films for Deoxidization and Electrical Interconnection   Keon-Soo Jang   Industrial & Engineering Chemistry Research, v.57, no.21, pp.7181-7187 11
Conference
2018 Quantifying Fluxing Capability of NCP and NCF   장건수   한국마이크로전자 및 패키징학회 학술 대회 (춘계) 2018, pp.33-33
Journal
2017 Hidden Innovations in the Fourth Industrial Revolution: Electronic Packaging Technology   최광성   전자통신동향분석, v.32, no.6, pp.17-26
Conference
2017 Silica Filler Content in NCP and its Effects on the Reliability of 3D TSV Multi-Stack under Thermal Shock Test   Wagno Alves Braganca Junior   Electronics Packaging Technology Conference (EPTC) 2017, pp.1-8 7
Conference
2017 Development of Stacking Process for 3D TSV (Through Silicon Via) Structure using Laser   Kwang-Seong Choi   International Microelectronics Assembly and Packaging Society (IMAPS) 2017, pp.1-5
Conference
2017 Micro Thermoelectric Cooler for Optical Transmitter using Silicon Substrate   Hyun-cheol Bae   International Conference on Advanced Electromaterials (ICAE) 2017, pp.1-1
Conference
2017 Low-temperature Sintering Behavior of Ternary Solder and Copper Powder for High-Power Device Packaging   Yong-Sung EOM   European Microelectronics and Packaging Conference (EMPC) 2017, pp.1-4 0
Conference
2017 Solvent-free Fluxing Underfill Film for Electrical Interconnection   Keon-Soo Jang   European Microelectronics and Packaging Conference (EMPC) 2017, pp.1-4 3
Conference
2017 Power Device Packaging for Electric Vehicle   배현철   대한전자공학회 종합 학술 대회 (하계) 2017, pp.1663-1664
Conference
2017 Micro Thermoelectric Cooler for Optical Transmitter   배현철   한국마이크로전자 및 패키징학회 학술 대회 (춘계) 2017, pp.38-38
Journal
2016 Curing Kinetics and Chemorheological Behavior of No-flow Underfill for Sn/In/Bi Solder in Flexible Packaging Applications   Eom Yong-Sung   ETRI Journal, v.38, no.6, pp.1179-1189 4
Journal
2016 Thermoelectric Cooler Module with Enhanced Cooling Ability Using a Hybrid Cu Paste and a Si Substrate   Hyun-Cheol Bae   Journal of Nanoscience and Nanotechnology, v.16, no.12, pp.12732-12736 2
Journal
2016 Sn58Bi Solder Interconnection for Low-Temperature Flex-on-Flex Bonding   Haksun Lee   ETRI Journal, v.38, no.6, pp.1163-1171 13
Conference
2016 Thermal and Electrical Designs of RF 3D Module Based on Si Interposers with Redundant TSVs   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2016, pp.2051-2057 2
Conference
2016 Analysis of Bond Pull Test using Al Ultrasonic Bonding Process   오애선   대한전자공학회 종합 학술 대회 (하계) 2016, pp.1-3
Journal
2016 Characterization of Transmission Lines with Through-silicon-vias and Bump Joints on High-resistivity Si Interposers for RF Three-dimensional Modules   Kwang-Seong Choi   Japanese Journal of Applied Physics, v.55, no.6S3, pp.1-5 2
Conference
2015 Characterization of Hybrid Underfill for Low-Temperature Process Applicable to Flexible Substrate   Jihye Son   Electronics Packaging Technology Conference (EPTC) 2015, pp.1-4 0
Conference
2015 High Performance Thermoelectric Cooler Module Using Hybrid Cu Paste and Si Substrate   Hyun-Cheol Bae   International Conference on Advanced Electromaterials (ICAE) 2015, pp.1-1
Conference
2015 Cost-Effective Thermoelectric Cooler Module Using Isotropic Conductive Paste Based on Epoxy with Ag Coated Cu and Solder   Hyun-Cheol Bae   International Symposium on Microelectronics and Packaging (ISMP) 2015, pp.136-136
Conference
2015 Electrically Conductive Paste with Copper for Flexible Packaging Application   Yong-Sung EOM   International Symposium on Microelectronics and Packaging (ISMP) 2015, pp.144-144
Conference
2015 Design and Fabrication of Thermoelectric Generator Based on BiTe Legs   S. E. Moon   IUMRS International Conference on Advanced Materials (IUMRS-ICAM) 2015, pp.1-1
Conference
2015 Cost-Effective Thermoelectric Cooler Packaging Using Hybrid Cu Paste   Hyun-Cheol Bae   European Microelectronics and Packaging Conference (EMPC) 2015, pp.1-4
Conference
2015 Isotropic Conductive Paste Based on Epoxy with Ag Coated Cu and SAC305 Solder   Yong-Sung EOM   European Microelectronics and Packaging Conference (EMPC) 2015, pp.1-5
Journal
2015 Epoxy Solder Paste and Its Applications   문종태  대한용접·접합학회지, v.33, no.3, pp.32-39
Journal
2015 Novel Low-Volume Solder-on-Pad Process for Fine Pitch Cu Pillar Bump Interconnection   Hyun-Cheol Bae   한국마이크로전자 및 패키징학회지, v.22, no.2, pp.55-59
Conference
2015 Thermoelectric Cooler Module using Hybrid Cu Paste   배현철   한국전기전자재료학회 학술 대회 (하계) 2015, pp.1-1
Conference
2015 Isotropic Conductive Paste with Copper Powder for Flexible Thermoelectric Device   엄용성   한국전기전자재료학회 학술 대회 (하계) 2015, pp.1-1
Conference
2015 Characterization of 3D Stacked High Resistivity Si Interposers with Polymer TSV Liners for 3D RF Module   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2015, pp.928-933 4
Conference
2015 미세피치를 위한 Solder-on-Pad 공정 및 높이 예측   이학선   한국마이크로전자 및 패키징학회 학술 대회 (춘계) 2015, pp.1-1
Conference
2015 Hybrid Cu Paste를 적용한 열전 소자 모듈   배현철   한국마이크로전자 및 패키징학회 학술 대회 (춘계) 2015, pp.18-18
Conference
2015 Development of High-Resistivity Si Interposer for 3D RF Module   최광성   한국마이크로전자 및 패키징학회 학술 대회 (춘계) 2015, pp.9-9
Journal
2015 Interconnection Technology Based on InSn Solder for Flexible Display Applications   Kwang-Seong Choi   ETRI Journal, v.37, no.2, pp.387-394 13
Conference
2015 Maskless Screen Printing Technology using Solder Bump Maker (SBM) for Flexible Electronics   Kwang-Seong Choi   International Conference on Electronics Packaging & iMAPS All Asia Conference (ICEP & IAAC) 2015, pp.276-291
Journal
2015 Development of Copper Electro-Plating Technology on a Screen-Printed Conductive Pattern with Copper Paste   Yong-Sung Eom   한국마이크로전자 및 패키징학회지, v.22, no.1, pp.51-54
Conference
2014 Development of Fluxing Underfill for Sn/27In/54Bi Solder with Melting Temperature of 83℃   정이슬   한국마이크로전자 및 패키징학회 학술 대회 2014, pp.1-1
Conference
2014 Non-Destructive Inspection of 3D stacked TSV Module Using X-ray Computed Tomography   배현철   한국마이크로전자 및 패키징학회 학술 대회 2014, pp.1-1
Conference
2014 Shear Strength Analysis of Hybrid Cu Paste for Thermoelectric Device Module   오애선   한국마이크로전자 및 패키징학회 학술 대회 2014, pp.1-1
Conference
2014 Study of Process Development for HU with a High Thixotropy   손지혜   한국마이크로전자 및 패키징학회 학술 대회 2014, pp.1-1
Journal
2014 Characterization and Estimation of Solder-on-Pad Process for Fine-Pitch Applications   Haksun Lee   IEEE Transactions on Components, Packaging, and Manufacturing Technology, v.4, no.10, pp.1729-1738 14
Conference
2014 Flip-Chip Bonding Processes with Low Volume SoP Technology   Yong-Sung EOM   Electronic System-Integration Technology Conference (ESTC) 2014, pp.1-4 0
Conference
2014 Development of Low Contact Resistance Interconnection for Display Applications   Haksun Lee   Electronic System-Integration Technology Conference (ESTC) 2014, pp.1-5 4
Journal
2014 Characterization of Fluxing and Hybrid Underfills with Micro-encapsulated Catalyst for Long Pot Life   Yong-Sung Eom   ETRI Journal, v.36, no.3, pp.343-351 35
Conference
2014 Maskless Screen Printing Technology for 20μm-Pitch, 52InSn Solder Interconnections in Display Applications   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2014, pp.1154-1159 8
Journal
2013 Fine‐Pitch Solder on Pad Process for Microbump Interconnection   Hyun-Cheol Bae   ETRI Journal, v.35, no.6, pp.1152-1155 22
Journal
2013 Recent Trends of Flip Chip Bonding Technology   최광성   전자통신동향분석, v.28, no.5, pp.100-110
Conference
2013 Novel Low-Volume Solder-on-Pad for Fine-Pitch Cu Pillar Bump   Hyun-Cheol Bae   European Microelectronics and Packaging Conference (EMPC) 2013, pp.1-4
Conference
2013 Novel Interconnection Technology for Flex-on-Glass (FOG) Applications   Haksun Lee   European Microelectronics and Packaging Conference (EMPC) 2013, pp.1-5
Conference
2013 Thermally Activated Bumping Process using Sn3.0Ag0.5Cu Solder Powder for Low-Cost Interposers   Kwang-Seong Choi   International Symposium on Microelectronics (IMAPS) 2013, pp.420-423 0
Journal
2013 Optimization of Material and Process for Fine Pitch LVSoP Technology   Yong-Sung Eom   ETRI Journal, v.35, no.4, pp.625-631 21
Conference
2013 Epoxy Copper Paste as an Isotropic Conductive Adhesive   Yong-Sung EOM   International Conference on Electronics Packaging (ICEP) 2013, pp.507-510
Journal
2013 Novel Bumping Process for Solder on Pad Technology   Kwang-Seong Choi   ETRI Journal, v.35, no.2, pp.340-343 23
Conference
2012 Fine-Pitch, Low-Volume SoP(Solder-on-Pad) Process   Ho-Eun Bae   Electronics Packaging Technology Conference (EPTC) 2012, pp.723-727 2
Conference
2012 Novel Solder-on-Pad (SoP) Material and Process for Low-Cost Interposers   Kwang-Seong Choi   Annual Global Interposer Technology Workshop (GIT) 2012, pp.1-2
Journal
2012 Novel Bumping and Underfill Technologies for 3D IC integration   Ki-Jun Sung  ETRI Journal, v.34, no.5, pp.706-712 30
Conference
2012 3D SiP Module Using TSV and Novel Low-Volume Solder-on-Pad(SoP) Process   Hyun-Cheol Bae   Electronic System-Integration Technology Conference (ESTC) 2012, pp.1-4 1
Conference
2012 Novel Low-Volume Solder-on-Pad (SoP) Material and Process for Flip Chip Bonding Using Au Stud Bumps   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2012, pp.1919-1924 1
Journal
2012 Technical Trends of Interposers for 2.5D Integration   최광성   전자통신동향분석, v.27, no.1, pp.51-60
Conference
2011 SoP(Solder on Pad) Technology with SBM(Solder Bump Maker) Material   노정현   한국마이크로전자 및 패키징학회 학술 대회 (추계) 2011, pp.1-1
Conference
2011 Low-volume Solder-on-Pad Technology for 3D IC Integration   배호은   한국마이크로전자 및 패키징학회 학술 대회 (추계) 2011, pp.1-1
Conference
2011 Chip-to-chip Bonding용 Fluxing Underfill 개발   전수정   한국마이크로전자 및 패키징학회 학술 대회 (추계) 2011, pp.1-1
Journal
2011 Novel Bumping Material for Solder-on-Pad Technology   Kwang-Seong Choi   ETRI Journal, v.33, no.4, pp.637-640 31
Conference
2011 Bumping and Stacking Processes for 3D IC using Fluxfree Polymer   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2011, pp.1746-1751 3
Journal
2010 Chemo-Rheological Characteristics of a Self-Assembling Anisotropic Conductive Adhesive System Containing a Low-Melting Point Solder   Ji-Won Baek  Microelectronic Engineering, v.87, no.10, pp.1968-1972 31
Journal
2010 3D IC Using through Silicon via Technologies   최광성   전자통신동향분석, v.25, no.5, pp.97-105
Conference
2010 Solder Bump Maker with Coining Process on TSV Chips for 3D Packages   Ki-Jun Sung  International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP) 2010, pp.185-189 3
Conference
2010 Novel Solder-on-Pad (SoP) Technology for Fine-Pitch Flip Chip Bonding   Kwang-Seong Choi   International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP) 2010, pp.805-805 3
Journal
2010 Electrical Interconnection with a Smart ACA Composed of Fluxing Polymer and Solder Powder   Yong-Sung Eom   ETRI Journal, v.32, no.3, pp.414-421 51
Conference
2010 Optimized TSV Process using Bottom-up Electroplating without Wafer Cracks   Byeong-Ok Lim  Electronic Components and Technology Conference (ECTC) 2010, pp.1642-1646 6
Conference
2010 3D SiP Module using TSV and Novel Solder Bump Maker   Hyun-Cheol Bae   Electronic Components and Technology Conference (ECTC) 2010, pp.1637-1641 5
Journal
2010 Novel Maskless Bumping for 3D Integration   Kwang-Seong Choi   ETRI Journal, v.32, no.2, pp.342-344 37
Journal
2009 Catalytic Behavior of Sn/Bi Metal Powder in Anhydride-Based Epoxy Curing   Keon Soo Jang   Journal of Nanoscience and Nanotechnology, v.9, no.12, pp.7461-7466 31
Conference
2009 Novel Bumping Material for Stacking Silicon Chips   Kwang Seong Choi   Electronics Packaging Technology Conference (EPTC) 2009, pp.579-583 2
Journal
2009 Development of High-Quality LTCC Solenoid Inductor using Solder Ball and Air Cavity for 3-D SiP   Hyun-Cheol Bae   한국마이크로전자 및 패키징학회지, v.46, no.4, pp.5-8
Conference
2009 산화막 제거 기능이 있는 플럭싱 고분자 수지의 공정 특성 연구   이종진   한국마이크로전자 및 패키징학회 학술 대회 (추계) 2009, pp.1-1
Journal
2009 Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)   Byung Seung Yim  Materials Transactions, v.50, no.7, pp.1684-1689 6
Journal
2009 Design and Fabrication of 1.25-Gb/s Full-Triplex Transceiver Module With PLC on a Lossy Si Substrate for G/E-PONs   Sung Il Kim   Journal of Lightwave Technology, v.27, no.6, pp.679-687 0
Journal
2008 Electrical and Mechanical Characterization of an Anisotropic Conductive Adhesive with a Low Melting Point Solder   Yong-Sung Eom   Microelectronic Engineering, v.85, no.11, pp.2202-2206 32
Journal
2008 3D SiP(System-in-Package) 기술 동향   최광성   주간기술동향, v.1367, pp.14-27
Conference
2008 Thermal Latent Catalytic Behavior of a Sn/Bi Metal Powder in Thermosetting Materials   Keon Soo Jang   International Conference on Nanoscale Materials and Engineering (ICNME) 2008, pp.1-1
Journal
2008 Characterization of Polymer Matrix and Low Melting Point Solder for Anisotropic Conductive Film   Yong-Sung Eom   Microelectronic Engineering, v.85, no.2, pp.327-331 64
Conference
2007 저융점 솔더를 사용한 이방성 도전 접속제 (ACF) 연구   엄용성   한국재료학회 학술 발표회 (춘계) 2007, pp.12-12
Conference
2007 저융점 솔더를 사용한 이방성 도전 접속제의 전기 기계적 특성 연구   엄용성   한국고분자학회 학술 대회 (춘계) 2007, pp.65-65
Conference
2006 Development of Optical Components for the Access Network   백용순   광자기술 학술 회의 (PC) 2006, pp.1-2
Conference
2006 1.25Gbps Optical Triplexer Module with Planar Lightwave Circuit   Yong Sung Eom   International Symposium on Microelectronics (IMAPS) 2006, pp.1319-1323
Conference
2006 Polymeric Variable Optical Attenuator based on Surface Plasmon Polariton   Sun Tak Park   Photonics Europe, pp.1-7 0
Conference
2006 1.25Gbps Optical Triplexer Module using Planar Lightwave Circuit   엄용성   한국반도체 학술 대회 (KCS) 2006, pp.1-2
Conference
2004 반도체광전치증폭기가 집적된10Gb/s 마흐-젠더 파장변환기의 동적 입력 파워 범위의 증가   Hyun-Soo Kim   Optoelectronics and Communications Conference (OECC) 2004, pp.380-381
Conference
2004 10 Gb/s All-Optical Mach-Zehnder Interferometric Wavelength Converter module with Monolithically integrated SOA preamplifiers.   김현수   COOC04, pp.193-194
Conference
2003 Electrical crosstalk analysis for gigabit optical transceiver module   Sung-IL Kim   Pacific Rim Conference on Lasers and Electro-Optics (CLEO-PR) 2003, pp.572-572 3
Journal
2003 Fabrications and characteristics of XPM based wavelength converter module with monolithically integrated SOA’s   김종회   한국광학회지, v.14, no.5, pp.509-514
Conference
2003 Packaging technology for wavelength tunable filter based on optical MEMS   Yong-Sung Eom   IEEE LEOS International Conference on Optical MEMS 2003, pp.67-68 0
Conference
2003 Optical design of tunable Ld module   최병석   광전자 및 광통신 학술 회의 (COOC) 2003, pp.535-536
Conference
2003 Optical Design for 2D-MOEMS Switch Packaging   엄용성   광전자 및 광통신 학술 회의 (COOC) 2003, pp.437-378
Conference
2003 Mach-Zehnder interferometric wavelength converter with monolithically integrated semiconductor optical amplifiers for 40nm span   김종회   광전자 및 광통신 학술 회의 (COOC) 2003, pp.1-2
Conference
2002 Fabrication and measurement of waveguide photodiodes for 40 Gbps optical receiver   권용환   Photonics Conference 2002, pp.85-86
Conference
2002 Fabrication of 50GHz internal wavelength locker module for multi-channel tunable laser diodes in DWDM applications   박흥우   Photonics Conference 2002, pp.13-14