ETRI-Knowledge Sharing Plaform

KOREAN

Researchers

연구자 검색
Keyword

Detail

사진

Choi Kwang-Seong
Department
Low-Carbon Integration Technology Creative Research Section
Contact
KSP Keywords
논문 검색결과
Type Year Title Cited Download
Journal
2024 Microlens Encapsulation of Thixotropic Siloxane/Silica Nanocomposites for Highly Efficient and Reliable Micro‐Light‐Emitting Diodes   Byung Jo Um, Hyungshin Kweon, Jiho Joo   ADVANCED OPTICAL MATERIALS, v.12, no.34, pp.1-9 0
Conference
2024 Simultaneous Transfer and Bonding (SITRAB) Technology for Micro-LED Display Fabrication   Jungho Shin   International Display Workshops (IDW) 2024, pp.1093-1095
Conference
2024 Enhancing Reliability of 30μm-Pitch Interconnections Using Room Temperature Laser-Assisted Bonding with Compression (LABC) with Laser Non-Conductive Paste (LNCP)   Gaeun Lee   International Symposium on Microelectronics and Packaging (ISMP) 2024, pp.1-14
Conference
2024 Simultaneous Transfer and Bonding (SITRAB) Technology for Integrating Micro-LEDs onto Display Backplanes   Jungho Shin   International Symposium on Microelectronics and Packaging (ISMP) 2024, pp.1-15
Conference
2024 Laser Assisted Bonding (LAB) technology using Laser Non-Conductive Paste (NCP) for Micro solder bumps   Ki-Seok Jang   International Symposium on Microelectronics and Packaging (ISMP) 2024, pp.272-272
Conference
2024 Low-Carbon Epoxy-Siloxane Flux Technology for Fine-Pitch Solder Bump Interconnection   Gwang-Mun Choi   International Symposium on Microelectronics and Packaging (ISMP) 2024, pp.164-164
Conference
2024 Heat dissipation evaluation of epoxy-boron nitride-based non-conductive films with high thermal conductivity for fine-pitch solder bump interconnection   J.H. Oh   European Materials Research Society (E-MRS) Meeting 2024 (Fall), pp.1-1
Conference
2024 Laser Assisted Bonding (LAB) based Flip-chip process for fine pitch solder bumps device using Laser Non-Conductive Paste (NCP)   Ki-Seok Jang   Electronic System-Integration Technology Conference (ESTC) 2024, pp.1-4
Conference
2024 Sustainable Epoxy-Functionalized Vanillic Acid-Siloxane Nanocomposite Adhesive for Fine-Pitch Solder Bump Interconnection   G.M. Choi   European Materials Research Society (E-MRS) Meeting 2024 (Fall), pp.1-1
Conference
2024 Micro-LED Bonding and Repair on Display Backplanes by Simultaneous Transfer and Bonding (SITRAB) Technology   Jungho Shin   International Meeting on Information Display (IMID) 2024, pp.1-1
Conference
2024 Micro-LED display fabrication method using simultaneous transfer and bonding (SITRAB) technology   신정호   대한전자공학회 학술 대회 (하계) 2024, pp.3346-3347
Conference
2024 Never drying solder paste at room temperature for semiconductor packaging process   엄용성   대한전자공학회 학술 대회 (하계) 2024, pp.3344-3345
Conference
2024 Development of a Full-Color MicroLED Display Utilizing Novel Simultaneous Transfer and Bonding (SITRAB) Process and SITRAB Film Technology   Jiho Joo   Society for Information Display (SID) International Symposium 2024, pp.1309-1312
Conference
2024 Chip-on-Wafer (CoW) Technology Utilizing LaserAssisted Bonding with Compression (LABC) for Bump Counts Exceeding 500,000 at a 20m Pitch   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2024, pp.943-948 0
Conference
2024 Transfer, Bonding, and Repair of LEDs for µLED Display Fabrication via Simultaneous Transfer and Bonding (SITRAB) Technology   Jungho Shin   Society for Information Display (SID) International Symposium 2024, pp.1278-1281
Conference
2024 Process window of Laser Non-Conductive Paste for Flip-chip Laser-Assisted Bonding   엄용성   한국마이크로전자 및 패키징학회 학술 대회 2024, pp.43-43
Conference
2024 Transfer, bonding, repair of LEDs via simultaneous transfer and bonding (SITRAB) technology   신정호   한국마이크로전자 및 패키징학회 학술 대회 2024, pp.1-1
Journal
2024 Process window of simultaneous transfer and bonding materials using laser‐assisted bonding for mini‐ and micro‐LED display panel packaging   Yong-Sung Eom   ETRI Journal, v.46, no.2, pp.347-359 5
Conference
2023 94GHz Fan-Out Wafer-Level Packaging (FOWLP) for High-Resolution Proximity Sensors, Autonomous Driving, and 5G/6G Telecommunication Systems   Jiho Joo   International Symposium on Microelectronics and Packaging (ISMP) 2023, pp.1-23
Conference
2023 Process Window of Mini-LED Display Panel Packaging using Laser Assisted Bonding Technology   Yong-Sung Eom   European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 0
Conference
2023 Anisotropic Solder Paste (ASP) Material Solution for Laser Assisted Bonding (LAB) Process   Ki-Seok Jang   European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 0
Conference
2023 Highly reliable Mini-LED display module using simultaneous transfer and bonding (SITRAB) technology   Jiho Joo   International Meeting on Information Display (IMID) 2023, pp.1-1
Conference
2023 Laser-Assisted Bonding with Compression (LABC) based Tiling Bonding Technology, Enabling Technology for Chiplet Integration   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2023, pp.1385-1389 3
Conference
2023 Development of a highly reliable Mini-LED display module using simultaneous transfer and bonding (SITRAB) technology   Jiho Joo   Society for Information Display (SID) International Symposium 2023, pp.433-436 2
Conference
2023 Development of Bonding Technology of HBM2-Level Stacked Chip with Reliability using Developed Electroplating Materials   엄용성   한국표면공학회 학술 대회 (춘계) 2023, pp.70-70
Conference
2022 Isosorbide-Based Organic-Inorganic Hybrid Materials for Green Chemistry   Gwang-Mun Choi   Materials Research Society (MRS) Meeting 2022 (Fall), pp.1-2
Conference
2022 Epoxy based Solder Paste for Flexible Substrate with Laser Assisted Bonding Process   Ki-Seok Jang   Electronic System-Integration Technology Conference (ESTC) 2022, pp.28-30 2
Conference
2022 Micro/Mini LED Array Transferred onto a Flexible Substrate Using Simultaneous Transfer and Bonding (SITRAB) Process and Anisotropic Solder Film (ASF)   Jiho Joo   International Meeting on Information Display (IMID) 2022, pp.1-19
Conference
2022 Development of Flexible full-color Mini-LED display using simultaneous transfer and bonding (SITRAB) technology   주지호   대한전자공학회 학술 대회 (하계) 2022, pp.1-2
Conference
2022 Mini LED array transferred onto a flexible substrate using Simultaneous Transfer and Bonding (SITRAB) process and Anisotropic Solder Film (ASF)   Jiho Joo   Electronic Components and Technology Conference (ECTC) 2022, pp.619-624 1
Conference
2022 Interconnection Reliability of Mini LEDs for Display Applications   In-Seok Kye   Electronic Components and Technology Conference (ECTC) 2022, pp.1184-20 0
Conference
2022 Evaluation of Solder Wetting and Screen-Printing with Dry-Free Solder Paste   장기석   대한용접접합학회 학술 발표 대회 (춘계) 2022, pp.1-13
Conference
2022 74‐4: Development of Flexible Full‐Color Mini‐LED Display Using Simultaneous Transfer and Bonding (SITRAB) Technology   Jiho Joo   Society for Information Display (SID) International Symposium 2022, pp.1005-1008 13
Conference
2022 Interconnection Reliability Analysis of Mini-LEDs for Display Applications   In-Seok Kye   대한용접접합학회 학술 발표 대회 (춘계) 2022, pp.1-19
Conference
2022 Laser-Assisted Bonding (LAB) Process and its Bonding Materials as Technologies enabling the Low-Carbon Era   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2022, pp.196-203 4
Conference
2022 Development of Mini-LED display using simultaneous transfer and bonding (SITRAB) technology   주지호   한국마이크로전자 및 패키징학회 학술 대회 2022, pp.1-2
Journal
2022 MicroLED Transfer, Bonding, and Bad Pixel Repair Technology   최광성   전자통신동향분석, v.37, no.2, pp.53-61
Conference
2022 Dry-Free Solder Paste with No Viscosity change at R.T. & No Adhesion change after Screen-Printing Process   장기석   한국마이크로전자 및 패키징학회 학술 대회 2022, pp.1-1
Conference
2022 Comparison of mini-LED bonding using ACF(Anisotropic conductive film) and ASF(Anisotropic solder film)   이찬미   한국마이크로전자 및 패키징학회 학술 대회 2022, pp.1-2
Conference
2021 W-band SiGe BiCMOS Mixer MMIC   이상흥   대한전자공학회 학술 대회 (하계) 2021, pp.2275-2277
Conference
2021 Simultaneous Transfer and Bonding (SITRAB) Process for Micro-LEDs Using Laser-Assisted Bonding with Compression (LABC) Process and SITRAB Adhesive   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2021, pp.1607-1613 12
Conference
2021 Development of simultaneous transferring and bonding (SITRAB) process for µLED arrays using Anisotropic Solder Paste (ASP) and Laser-Assisted Bonding (LAB) Technology   Jiho Joo   Electronic Components and Technology Conference (ECTC) 2021, pp.687-692 5
Conference
2021 59‐5: Simultaneous Transfer and Bonding (SITRAB) Process for Mini‐LED Display   Kwang-Seong Choi   Society for Information Display (SID) International Symposium 2021, pp.841-844 5
Journal
2021 Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining   Gwang-Mun Choi   Polymers, v.13, no.6, pp.1-14 10
Conference
2020 Low fume and No-cleaning Solder Wire Technology   장기석   한국마이크로전자 및 패키징학회 2020, pp.1-1
Conference
2020 Development of LAB-based low thermal deformation bonding technology for PCT substrates that are vulnerable to thermal processes   이찬미   한국마이크로전자 및 패키징학회 학술 대회 2020, pp.1-14
Conference
2020 Study on Epoxy-Solder Hybrid Underfill Material for Fine-Pitch Bonding Application   최광문   한국마이크로전자 및 패키징학회 학술 대회 2020, pp.1-1
Conference
2020 Development of film-based ultra-compact GaAs photovoltaic module using Laser-Assisted Bonding   Jiho Joo   European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC) 2020, pp.1-1
Conference
2020 0.13 um SiGe BiCMOS를 이용한 94 GHz 믹서 MMIC 설계 및 제작   이상흥   한국전자파학회 종합 학술 대회 (하계) 2020, pp.795-795
Journal
2020 Epoxy-based Interconnection Materials and Process Technology Trends for Semiconductor Packaging   엄용성   전자통신동향분석, v.35, no.4, pp.1-10
Conference
2020 Development of bonding process for flexible devices with fine-pitch interconnection using Anisotropic Solder Paste and Laser-Assisted Bonding Technology   Jiho Joo   Electronic Components and Technology Conference (ECTC) 2020, pp.1309-1314 11
Conference
2020 Development of Digital Signage Modules composed of Mini-LEDs using Laser-Assisted Bonding (LAB) Technology   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2020, pp.1031-1036 9
Journal
2020 Application of Aluminum Flat Heat Pipe for Dry Cooling near the Hot Spot of a Radar Array with a Multiscale Structure   Seok-Hwan Moon   Applied Thermal Engineering, v.169, pp.1-9 10
Journal
2019 Conductive adhesive with transient liquid‐phase sintering technology for high‐power device applications   Yong-Sung Eom   ETRI Journal, v.41, no.6, pp.820-828 8
Conference
2019 Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration   Kwang-Seong Choi   International 3D Systems Integration Conference (3DIC) 2019, pp.1-3 2
Conference
2019 Advanced Interconnection technology with Laser Assisted Bonding Process for PET Substrate   Yong-Sung Eom   European Microelectronics and Packaging Conference (EMPC) 2019, pp.1-5 0
Conference
2019 Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2019, pp.197-203 19
Conference
2019 Design of 94 GHz SiGe Mixer MMIC   이상흥   한국통신학회 종합 학술 발표회 (동계) 2019, pp.1076-1077
Journal
2018 Laser-Assisted Bonding Technology for Interconnections of Multidimensional Heterogeneous Devices   최광성   전자통신동향분석, v.33, no.6, pp.50-57
Conference
2018 A Solution of Aluminum Flat Heat Pipe for Dry Cooling the Ladar Array   Su-Hyeon Hong   International Heat Transfer Conference (IHTC) 2018, pp.1-8 0
Conference
2018 Thermal Analysis of SiC Power Semiconductor with Copper Clip Bonding and Copper Sintering Paste   In-Hoo Kim   International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 2018, pp.1-4
Journal
2018 Crosslinkable deoxidizing hybrid adhesive of epoxy–diacid for electrical interconnections in semiconductor packaging   Keon-Soo Jang   Polymer International, v.67, no.9, pp.1241-1247 21
Journal
2018 Synchronous curable deoxidizing capability of epoxy–anhydride adhesive: Deoxidation quantification via spectroscopic analysis   Keon-Soo Jang   Journal of Applied Polymer Science, v.135, no.33, pp.1-9 16
Conference
2018 Interconnection Process using Laser and Hybrid Underfill for LED Array Module on PET Substrate   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2018, pp.1561-1567 15
Journal
2018 Versatile Epoxy/Phenoxy/Anhydride-Based Hybrid Adhesive Films for Deoxidization and Electrical Interconnection   Keon-Soo Jang   Industrial & Engineering Chemistry Research, v.57, no.21, pp.7181-7187 11
Conference
2018 Quantifying Fluxing Capability of NCP and NCF   장건수   한국마이크로전자 및 패키징학회 학술 대회 (춘계) 2018, pp.33-33
Conference
2017 Development of Stacking Process for 3D TSV (Through Silicon Via) Structure using Laser   Kwang-Seong Choi   International Microelectronics Assembly and Packaging Society (IMAPS) 2017, pp.1-5
Journal
2017 Hidden Innovations in the Fourth Industrial Revolution: Electronic Packaging Technology   최광성   전자통신동향분석, v.32, no.6, pp.17-26
Conference
2017 Silica Filler Content in NCP and its Effects on the Reliability of 3D TSV Multi-Stack under Thermal Shock Test   Wagno Alves Braganca Junior   Electronics Packaging Technology Conference (EPTC) 2017, pp.1-8 7
Conference
2017 Micro Thermoelectric Cooler for Optical Transmitter using Silicon Substrate   Hyun-cheol Bae   International Conference on Advanced Electromaterials (ICAE) 2017, pp.1-1
Conference
2017 Low-temperature Sintering Behavior of Ternary Solder and Copper Powder for High-Power Device Packaging   Yong-Sung EOM   European Microelectronics and Packaging Conference (EMPC) 2017, pp.1-4 0
Conference
2017 Solvent-free Fluxing Underfill Film for Electrical Interconnection   Keon-Soo Jang   European Microelectronics and Packaging Conference (EMPC) 2017, pp.1-4 3
Conference
2017 Power Device Packaging for Electric Vehicle   배현철   대한전자공학회 종합 학술 대회 (하계) 2017, pp.1663-1664
Conference
2017 Micro Thermoelectric Cooler for Optical Transmitter   배현철   한국마이크로전자 및 패키징학회 학술 대회 (춘계) 2017, pp.38-38
Journal
2016 Thermoelectric Cooler Module with Enhanced Cooling Ability Using a Hybrid Cu Paste and a Si Substrate   Hyun-Cheol Bae   Journal of Nanoscience and Nanotechnology, v.16, no.12, pp.12732-12736 2
Journal
2016 Sn58Bi Solder Interconnection for Low-Temperature Flex-on-Flex Bonding   Haksun Lee   ETRI Journal, v.38, no.6, pp.1163-1171 13
Journal
2016 Curing Kinetics and Chemorheological Behavior of No-flow Underfill for Sn/In/Bi Solder in Flexible Packaging Applications   Eom Yong-Sung   ETRI Journal, v.38, no.6, pp.1179-1189 4
Conference
2016 Thermal and Electrical Designs of RF 3D Module Based on Si Interposers with Redundant TSVs   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2016, pp.2051-2057 2
Conference
2016 Analysis of Bond Pull Test using Al Ultrasonic Bonding Process   오애선   대한전자공학회 종합 학술 대회 (하계) 2016, pp.1-3
Conference
2016 Development of an Aluminum Flat Heat Pipe with Carbon Wire Wick   Yoon Woo Park   International Heat Pipe Conference (IHPC) 2016 / International Heat Pipe Symposium (IHPS) 2016, pp.1-6
Journal
2016 Characterization of Transmission Lines with Through-silicon-vias and Bump Joints on High-resistivity Si Interposers for RF Three-dimensional Modules   Kwang-Seong Choi   Japanese Journal of Applied Physics, v.55, no.6S3, pp.1-5 2
Conference
2015 Characterization of Hybrid Underfill for Low-Temperature Process Applicable to Flexible Substrate   Jihye Son   Electronics Packaging Technology Conference (EPTC) 2015, pp.1-4 0
Conference
2015 High Performance Thermoelectric Cooler Module Using Hybrid Cu Paste and Si Substrate   Hyun-Cheol Bae   International Conference on Advanced Electromaterials (ICAE) 2015, pp.1-1
Conference
2015 Electrically Conductive Paste with Copper for Flexible Packaging Application   Yong-Sung EOM   International Symposium on Microelectronics and Packaging (ISMP) 2015, pp.144-144
Conference
2015 Cost-Effective Thermoelectric Cooler Module Using Isotropic Conductive Paste Based on Epoxy with Ag Coated Cu and Solder   Hyun-Cheol Bae   International Symposium on Microelectronics and Packaging (ISMP) 2015, pp.136-136
Conference
2015 Isotropic Conductive Paste Based on Epoxy with Ag Coated Cu and SAC305 Solder   Yong-Sung EOM   European Microelectronics and Packaging Conference (EMPC) 2015, pp.1-5
Conference
2015 Cost-Effective Thermoelectric Cooler Packaging Using Hybrid Cu Paste   Hyun-Cheol Bae   European Microelectronics and Packaging Conference (EMPC) 2015, pp.1-4
Conference
2015 Thermoelectric Cooler Module using Hybrid Cu Paste   배현철   한국전기전자재료학회 학술 대회 (하계) 2015, pp.1-1
Conference
2015 Isotropic Conductive Paste with Copper Powder for Flexible Thermoelectric Device   엄용성   한국전기전자재료학회 학술 대회 (하계) 2015, pp.1-1
Journal
2015 Novel Low-Volume Solder-on-Pad Process for Fine Pitch Cu Pillar Bump Interconnection   Hyun-Cheol Bae   한국마이크로전자 및 패키징학회지, v.22, no.2, pp.55-59
Conference
2015 Characterization of 3D Stacked High Resistivity Si Interposers with Polymer TSV Liners for 3D RF Module   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2015, pp.928-933 4
Journal
2015 Interconnection Technology Based on InSn Solder for Flexible Display Applications   Kwang-Seong Choi   ETRI Journal, v.37, no.2, pp.387-394 13
Conference
2015 미세피치를 위한 Solder-on-Pad 공정 및 높이 예측   이학선   한국마이크로전자 및 패키징학회 학술 대회 (춘계) 2015, pp.1-1
Conference
2015 Maskless Screen Printing Technology using Solder Bump Maker (SBM) for Flexible Electronics   Kwang-Seong Choi   International Conference on Electronics Packaging & iMAPS All Asia Conference (ICEP & IAAC) 2015, pp.276-291
Conference
2015 Development of High-Resistivity Si Interposer for 3D RF Module   최광성   한국마이크로전자 및 패키징학회 학술 대회 (춘계) 2015, pp.9-9
Conference
2015 Hybrid Cu Paste를 적용한 열전 소자 모듈   배현철   한국마이크로전자 및 패키징학회 학술 대회 (춘계) 2015, pp.18-18
Journal
2015 Development of Copper Electro-Plating Technology on a Screen-Printed Conductive Pattern with Copper Paste   Yong-Sung Eom   한국마이크로전자 및 패키징학회지, v.22, no.1, pp.51-54
Conference
2014 Fault Detection and Isolation of Multiple Defects in Through Silicon Via (TSV) Channel   Daniel H. Jung  International 3D Systems Integration Conference (3DIC) 2014, pp.1-5 5
Conference
2014 Shear Strength Analysis of Hybrid Cu Paste for Thermoelectric Device Module   오애선   한국마이크로전자 및 패키징학회 학술 대회 2014, pp.1-1
Conference
2014 Study of Process Development for HU with a High Thixotropy   손지혜   한국마이크로전자 및 패키징학회 학술 대회 2014, pp.1-1
Conference
2014 Non-Destructive Inspection of 3D stacked TSV Module Using X-ray Computed Tomography   배현철   한국마이크로전자 및 패키징학회 학술 대회 2014, pp.1-1
Conference
2014 Development of Fluxing Underfill for Sn/27In/54Bi Solder with Melting Temperature of 83℃   정이슬   한국마이크로전자 및 패키징학회 학술 대회 2014, pp.1-1
Journal
2014 Characterization and Estimation of Solder-on-Pad Process for Fine-Pitch Applications   Haksun Lee   IEEE Transactions on Components, Packaging, and Manufacturing Technology, v.4, no.10, pp.1729-1738 15
Conference
2014 Development of Low Contact Resistance Interconnection for Display Applications   Haksun Lee   Electronic System-Integration Technology Conference (ESTC) 2014, pp.1-5 4
Conference
2014 Flip-Chip Bonding Processes with Low Volume SoP Technology   Yong-Sung EOM   Electronic System-Integration Technology Conference (ESTC) 2014, pp.1-4 0
Journal
2014 Characterization of Fluxing and Hybrid Underfills with Micro-encapsulated Catalyst for Long Pot Life   Yong-Sung Eom   ETRI Journal, v.36, no.3, pp.343-351 35
Conference
2014 Maskless Screen Printing Technology for 20μm-Pitch, 52InSn Solder Interconnections in Display Applications   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2014, pp.1154-1159 8
Journal
2013 Fine‐Pitch Solder on Pad Process for Microbump Interconnection   Hyun-Cheol Bae   ETRI Journal, v.35, no.6, pp.1152-1155 22
Journal
2013 High-Performance Photoreceivers Based on Vertical-Illumination Type Ge-on-Si Photodetectors Operating up to 43 Gb/s at λ~1550nm   In Gyoo Kim   Optics Express, v.21, no.25, pp.30718-30725 15
Journal
2013 Recent Trends of Flip Chip Bonding Technology   최광성   전자통신동향분석, v.28, no.5, pp.100-110
Conference
2013 Novel Low-Volume Solder-on-Pad for Fine-Pitch Cu Pillar Bump   Hyun-Cheol Bae   European Microelectronics and Packaging Conference (EMPC) 2013, pp.1-4
Conference
2013 Novel Interconnection Technology for Flex-on-Glass (FOG) Applications   Haksun Lee   European Microelectronics and Packaging Conference (EMPC) 2013, pp.1-5
Conference
2013 Thermally Activated Bumping Process using Sn3.0Ag0.5Cu Solder Powder for Low-Cost Interposers   Kwang-Seong Choi   International Symposium on Microelectronics (IMAPS) 2013, pp.420-423 0
Journal
2013 Optimization of Material and Process for Fine Pitch LVSoP Technology   Yong-Sung Eom   ETRI Journal, v.35, no.4, pp.625-631 21
Conference
2013 Epoxy Copper Paste as an Isotropic Conductive Adhesive   Yong-Sung EOM   International Conference on Electronics Packaging (ICEP) 2013, pp.507-510
Journal
2013 Novel Bumping Process for Solder on Pad Technology   Kwang-Seong Choi   ETRI Journal, v.35, no.2, pp.340-343 23
Conference
2013 Si-interposer Design for GPU-Memory Integration concerning the Signal Integrity   Jonghyun Cho  DesignCon 2013, pp.1-20
Conference
2012 Fine-Pitch, Low-Volume SoP(Solder-on-Pad) Process   Ho-Eun Bae   Electronics Packaging Technology Conference (EPTC) 2012, pp.723-727 2
Conference
2012 Wafer Level Packaging for MEMS Devices   배현철   한국마이크로전자 및 패키징학회 학술 대회 2012, pp.6-6
Conference
2012 Novel Solder-on-Pad (SoP) Material and Process for Low-Cost Interposers   Kwang-Seong Choi   Annual Global Interposer Technology Workshop (GIT) 2012, pp.1-2
Conference
2012 Hybrid-Integrated Coherent Receiver Using Chip-to-Chip Bonding Technology   Jong-Hoi Kim   Asia Communications and Photonics Conference (ACP) 2012, pp.1-4
Journal
2012 Novel Bumping and Underfill Technologies for 3D IC integration   Ki-Jun Sung  ETRI Journal, v.34, no.5, pp.706-712 30
Journal
2012 Measurement of a Balanced Receiver's Skew Using Optoelectronic Interferometry   Joong-Seon Choe   Japanese Journal of Applied Physics, v.51, no.11, pp.1-2 0
Conference
2012 3D SiP Module Using TSV and Novel Low-Volume Solder-on-Pad(SoP) Process   Hyun-Cheol Bae   Electronic System-Integration Technology Conference (ESTC) 2012, pp.1-4 1
Conference
2012 Hybrid-Integrated Coherent Receiver Using Silica-Based PLC Technology   Jong-Hoi Kim   Opto-Electronics and Communications Conference (OECC) 2012, pp.216-217 1
Conference
2012 Frequency Domain Measurement of Balanced Receiver's Skew   Joong-Seon Choe   Opto-Electronics and Communications Conference (OECC) 2012, pp.619-620 0
Conference
2012 Novel Low-Volume Solder-on-Pad (SoP) Material and Process for Flip Chip Bonding Using Au Stud Bumps   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2012, pp.1919-1924 1
Journal
2012 Technical Trends of Interposers for 2.5D Integration   최광성   전자통신동향분석, v.27, no.1, pp.51-60
Conference
2012 Hybrid-Integrated Coherent Receiver Module Using Silica-Based Planar Lightwave Circuit Technology   김종회   한국광학회 학술 발표회 (동계) 2012, pp.208-209
Conference
2011 Cost-Effective and High-Performance FBAR Duplexer Module with Wafer Level Packaging   Hyun-Cheol Bae   Asia-Pacific Microwave Conference (APMC) 2011, pp.1074-1077
Conference
2011 SoP(Solder on Pad) Technology with SBM(Solder Bump Maker) Material   노정현   한국마이크로전자 및 패키징학회 학술 대회 (추계) 2011, pp.1-1
Conference
2011 Chip-to-chip Bonding용 Fluxing Underfill 개발   전수정   한국마이크로전자 및 패키징학회 학술 대회 (추계) 2011, pp.1-1
Conference
2011 Low-volume Solder-on-Pad Technology for 3D IC Integration   배호은   한국마이크로전자 및 패키징학회 학술 대회 (추계) 2011, pp.1-1
Conference
2011 Hybrid-integrated Coherent Receiver using Silica-based Planar Lightwave Circuit Technology   Yong-Hwan Kwon   Asia Communications and Photonics Conference (ACP) 2011, pp.1-6 0
Journal
2011 Novel Bumping Material for Solder-on-Pad Technology   Kwang-Seong Choi   ETRI Journal, v.33, no.4, pp.637-640 32
Journal
2011 Channel Estimation and Synchronization for Polarization-Division Multiplexed CO-OFDM Using Subcarrier/Polarization Interleaved Training Symbols   Chun Ju Youn   Optics Express, v.19, no.17, pp.16174-16181 27
Conference
2011 Bumping and Stacking Processes for 3D IC using Fluxfree Polymer   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2011, pp.1746-1751 3
Journal
2010 Coherent Optical Components Technology   권용환   전자통신동향분석, v.25, no.5, pp.47-58
Journal
2010 3D IC Using through Silicon via Technologies   최광성   전자통신동향분석, v.25, no.5, pp.97-105
Conference
2010 An Efficient and Frequency-Offset-Tolerant Channel Estimation and Synchronization Method for PDM CO-OFDM Transmission   Chun Ju Youn   European Conference on Optical Communication (ECOC) 2010, pp.1-3 8
Conference
2010 Novel Solder-on-Pad (SoP) Technology for Fine-Pitch Flip Chip Bonding   Kwang-Seong Choi   International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP) 2010, pp.805-805 3
Conference
2010 Solder Bump Maker with Coining Process on TSV Chips for 3D Packages   Ki-Jun Sung  International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP) 2010, pp.185-189 3
Conference
2010 3D SiP Module using TSV and Novel Solder Bump Maker   Hyun-Cheol Bae   Electronic Components and Technology Conference (ECTC) 2010, pp.1637-1641 5
Conference
2010 Optimized TSV Process using Bottom-up Electroplating without Wafer Cracks   Byeong-Ok Lim  Electronic Components and Technology Conference (ECTC) 2010, pp.1642-1646 6
Journal
2010 Novel Maskless Bumping for 3D Integration   Kwang-Seong Choi   ETRI Journal, v.32, no.2, pp.342-344 37
Conference
2010 Balanced Photoreceiver for QPSK Coherent Detection   최중선   한국 반도체 학술 대회 (KCS) 2010, pp.544-545
Journal
2009 40 Gb/s Traveling-Wave Electroabsorption Modulator-Integrated DFB Lasers Fabricated Using Selective Area Growth   Yong Hwan Kwon   ETRI Journal, v.31, no.6, pp.765-769 15
Journal
2009 Development of High-Quality LTCC Solenoid Inductor using Solder Ball and Air Cavity for 3-D SiP   Hyun-Cheol Bae   한국마이크로전자 및 패키징학회지, v.46, no.4, pp.5-8
Conference
2009 Novel Bumping Material for Stacking Silicon Chips   Kwang Seong Choi   Electronics Packaging Technology Conference (EPTC) 2009, pp.579-583 2
Conference
2009 Fabrication and Characterization of Balanced Photoreceiver   최중선   Photonics Conference 2009, pp.614-615
Journal
2009 삼차원 적층 패키징 기술 동향   최광성   전자공학회지, v.26, no.9, pp.51-60
Conference
2009 High-Quality LTCC Solenoid Inductor Using Air Cavity on Silicon Wafer for 3D Integrated Circuit   Hyun Cheol Bae   International Conference and Exhibition on Device Packaging (IMAPS) 2009, pp.1-1
Journal
2008 Integration and Characteristics of 40-Gb/s Electroabsorption Modulator Integrated Laser Module With a Driver Amplifier and Bias Tees   Ho Gyeong Yun   IEEE Transactions on Advanced Packaging, v.31, no.4, pp.855-860 5
Journal
2008 3D SiP(System-in-Package) 기술 동향   최광성   주간기술동향, v.1367, pp.14-27
Journal
2008 Temperature-Dependent Characteristics of Electroabsorption Modulator Modules for Analog 60-GHz Applications   Yong-Duck Chung   Journal of the Korean Physical Society, v.53, no.3, pp.1538-1541
Conference
2008 Development of SoP Transceiver for 60-GHz Pico-Cell Communications   Yong-Duck Chung   International Topical Meeting on Microwavw Photonics (MWP)2008/Asia-Pacific Microwave Photonics Conference (APMP) 2008, pp.150-153
Journal
2008 60-GHz System-on-Packaging Transmitter for Radio-Over-Fiber Applications   Je Ha Kim   Journal of Lightwave Technology, v.26, no.15, pp.2379-2387 9
Conference
2008 Development of SoP Trabceiver for 60 GHz Pico-cell Communications   정용덕   한국통신학회 종합 학술 발표회 (하계) 2008, pp.1211-1213
Journal
2008 Fabrication and Characteristics of 40-Gb/s Traveling-Wave Electroabsorption Modulator-Integrated DFB Laser Modules   Ho-Gyeong Yun   IEEE Transactions on Advanced Packaging, v.31, no.2, pp.351-356 10
Conference
2008 System-On-Packaging Transmitter for 60-GHz Electric-to-Optical Signal Conversion   Je Ha Kim   Global Symposium on Millimeter Waves (GSMM) 2008, pp.1-3 0
Journal
2008 System-on-Packaging with Electroabsorption Modulator for a 60-GHz Band Radio-Over-Fiber Link   Kwang-Seong Choi   IEEE Transactions on Advanced Packaging, v.31, no.1, pp.163-169 10
Journal
2008 A monolithic electro-absorption duplexer (EAD) integrated with a spot size converter   Jae-Sik Sim   Semiconductor Science and Technology, v.23, no.1, pp.1-4 0
Conference
2007 High-Frequency Characteristics of 40Gb/s Electroabsorption Modulator-Integrated DFB Lasers: Effect of Traveling-Wave Electrode and Tilted Facet   Yong-Hwan Kwon   Asia-Pacific Microwave Conference (APMC) 2007, pp.1-4 4
Conference
2007 Characteristics of Amplifier-integrated 40 Gbps Optical Receiver and Transmitter Modules   Kwang-Seong Choi   Electronics Packaging Technology Conference (EPTC) 2007, pp.604-608 0
Conference
2007 System-On-Packaging (SOP) with Electro-Absorption Duplexer (EAD) for 60 Ghz Band Radio-Over-Fiber Link   Kwang-Seong Choi   Electronics Packaging Technology Conference (EPTC) 2007, pp.600-603 0
Journal
2007 A 60-GHz-Band Analog Optical System-on-Package Transmitter for Fiber-Radio Communications   Yong-Duck Chung   IEEE/OSA Journal of Lightwave Technology, v.25, no.11, pp.3407-3412 22
Journal
2007 Development of 60-GHz Analog Optic Transmitter Module with Radio-frequency Gain for Radio-over-fiber Link   Yong-Duck Chung   Optical Engineering, v.46, no.11, pp.1-4 1
Conference
2007 60 GHz Band RF/RoF Link Characteristics of Enhanced Optical Transmitter SoP Module   Kwang-Seong Choi   European Microwave Conference (EuMC) 2007, pp.603-605 1
Conference
2007 Improving the Noise Figure of the 60-GHz Radio-over-Fiber System using a System-on-Package EAM Module with Two-Stage LNAs   Kang Baek Kim  International Topical Meeting on Microwave Photonics (MWP) 2007, pp.124-126 2
Conference
2007 Monolithically Integrated High Speed Optoelectronic Transceiver Device for RF-to-optic Signal Conversion   Je Ha Kim   Conference on Lasers and Electro-Optics/Pacific Rim (CLEO/PR) 2007, pp.1-2 0
Conference
2007 Monolithic Electroabsorption Modulator Integrated with Spot Size Converter   Jae-Sik Sim   Conference on Lasers and Electro-Optics/Pacific Rim (CLEO/PR) 2007, pp.1-2 0
Journal
2007 Harmonic Signal Generation and Frequency Up-Conversion Using a Hybrid Mode-Locked Multisection DFB Laser   Kwang-Hyun Lee  IEEE Photonics Technology Letters, v.19, no.12, pp.901-903 3
Conference
2007 60 GHz analog optical system-on-package transmitter   정용덕   광전자 및 광통신 학술 회의 (COOC) 2007, pp.291-292
Conference
2007 Characteristics of a Driver Amplifier Integrated 40 Gb/s EML Module   Ho-Gyeong Yun   Electronic Components and Technology Conference (ECTC) 2007, pp.1994-1999 2
Journal
2007 Characteristics of 60 GHz Analog RF-Optic Transceiver Module   Jeha Kim   IEICE Transactions on Electronics, v.E90-C, no.2, pp.359-364 2
Conference
2006 Electrical Characteristics of 60GHz Band Electro-Absorption Duplexer (EAD) Module   최광성   광자기술 학술 회의 (PC) 2006, pp.1-2
Conference
2006 Characteristics of 60 GHz Analog Optical Transmitter Modules for Radio-over-Fiber Applications   정용덕   Photonics Conference 2006, pp.1-2
Conference
2006 Characteristics of 60-GHz Analog Optical Transmitter Modules for Radio-over-Fiber Applications   Yong Duck Chung   IEEE Lasers and Electro-Optics Society (LEOS) Meeting 2006, pp.268-269 1
Journal
2006 Right-Angle-Bent CPW for the Application of the Driver-Amplifier-Integrated 40 Gbps TW-EML Module   Ho Gyeong Yun   ETRI Journal, v.28, no.5, pp.648-651 8
Conference
2006 Analysis of Crosstalk and Impedance Matching for 60 GHz Band Electro-Absorption Duplexer (EAD) Module   Kwang Seong Choi   International Topical Meeting on Microwave Photonics (MWP) 2006, pp.1-4 1
Journal
2006 Development of Packaging Technologies for High-Speed ($≫40$Gb/s) Optical Modules   Kwang Seong Choi   IEEE Journal of Selected Topics in Quantum Electronics, v.12, no.5, pp.1017-1023 7
Conference
2006 Analog RF-optic performance of 60 GHz electroabsorption duplexer module   J.S. Sim   Passive Components and Fiber-based Devices III (APOC) 2006 (SPIE 6352), v.6352, pp.1-9 0
Conference
2006 Transmitter Module with Electro-Absorption Modulator for 60 GHz Band Radio-over-Fiber Up Link   Kwang Seong Choi   International Conference on Optical Internet and Next Generation Network (COIN-NGNCON) 2006, pp.289-291 2
Conference
2006 60 GHz Analog Optic Transmitter Module for Radio-Over-Fiber Link   정용덕   한국광학회 학술 발표회 (하계) 2006, pp.363-364
Journal
2006 Narrow Band Electroabsorption Modulator Modules for a 60-GHz Radio-Over-Fiber Link   Yong Duck Chung   Journal of the Korean Physical Society, v.48, no.6, pp.1205-1209
Journal
2006 Analog Characteristics of Electroabsorption Modulator for RF/optic Conversion; RF Gain and IMD3   Yong Duck Chung   Microwave and Optical Technology Letters, v.48, no.6, pp.1151-1155 7
Journal
2006 New Impedance Matching Scheme for 60 GHz Band Electro-Absorption Modulator Modules   Kwang Seong Choi   ETRI Journal, v.28, no.3, pp.393-396 6
Conference
2006 System-on-Packaging with Electro-Absorption Modulator for 60 GHz band Radio-over-Fiber Link   Kwang Seong Choi   Electronic Components and Technology Conference (ECTC) 2006, pp.1-6
Conference
2006 Fabrication and Characteristics of 40 Gb/s Traveling-Wave Electroabsorption Modulator-Integrated DFB Laser Modules   Ho Gyeong Yun   Electronic Components and Technology Conference (ECTC) 2006, pp.1687-1692 3
Conference
2006 Development of 60 GHz Analog Optic Transmitter Module for Radioover-Fiber Link   정용덕   광전자 및 광통신 학술 회의 (COOC) 2006, pp.1-2
Conference
2006 Characteristics of 60 GHz Analog RF-Optic Transceiver Module   Je Ha Kim   Asia-Pacific Microwave Photonics Conference (AP-MWP) 2006, pp.1-4
Conference
2006 Development of 60 GHz Analog Optic Transmitter Module for Radio-over-Fiber Link   Yong Duck Chung   Asia-Pacific Microwave Photonics Conference (AP-MWP) 2006, pp.1-4
Journal
2006 Development and RF Characteristics of Analog 60-GHz Electroabsorption Modulator Module for RF/Optic Conversion   Je Ha Kim   IEEE Transactions on Microwave Theory and Techniques, v.54, no.2, pp.780-786 37
Conference
2005 Narrow Band Electroabsorption Modulator Modules for 60 GHz Radio-over-Fiber Link   Y. D. Chung   International Conference on Advanced Materials and Devices (ICAMD) 2006, pp.1-1
Conference
2005 Electroabsorption Duplexer Based on Dual Waveguide Structure with Spot Size Converter for Analog Application   Young Shik Kang   International Topical Meeting on Microwave Photonics (MWP) 2005, pp.41-44 4
Conference
2005 RF gain and IMD Characteristics of Electroabsorption Modulator for Analog Applications   Yong Duck Chung   International Topical Meeting on Microwave Photonics (MWP) 2005, pp.153-156 2
Journal
2005 광모드 변환기 집적된 도파로형 포토다이오드를 이용한 전단수신기의 제작   Yong-Hwan Kwon   ETRI Journal, v.27, no.5, pp.484-490 36
Conference
2005 Narrow Band Optical Modulator for 60 GHz RF/Optic Conversion   Yong Duck Chung   OptoElectronics and Communications Conference (OECC) 2005, pp.1-2
Conference
2005 60 GHz RF/optic Conversion with Narrow Band Optical Modulator   정용덕   Conference on Optoelectronics and Optical Communications (COOC) 2005, pp.1-2
Conference
2005 Radio-Over-Fiber (ROF) Link for 60 GHz WLAN   김제하   Conference on Optoelectronics and Optical Communications (COOC) 2005, pp.1-2
Conference
2005 Analog Characteristics of 40 GHz Traveling Wave Electroabsorption Modulators   Yong Duck Chung   Korea-Japan Joint Workshop on Microwave and Millimeterwave Photonics (KJMMWP) 2005, pp.1-4
Journal
2004 Optimization of Packaging Design of TWEAM Module for Digital and Analog Applications   Kwang Seong Choi   ETRI Journal, v.26, no.6, pp.589-596 17
Conference
2004 Study on cost-effective WDM-PON system using RSOA   이우람   Photonics Conference 2004, pp.17-18
Conference
2004 Electrical property of the narrow band electroabsorption optical modulator   정용덕   Photonics Conference 2004, pp.237-238
Journal
2004 Thermally controlled wavelength locker integrated in widely tunable SGDBR-LD module   Jongdeog Kim   IEEE Photonics Technology Letters, v.16, no.11, pp.2430-2432 5
Journal
2003 Analysis and characterization of traveling-wave electrode in electroabsorption modulator for radio-on-fiber application   Jiyoun Lim   IEEE/OSA Journal of Lightwave Technology, v.21, no.12, pp.3004-3010 33
Conference
2003 Electrical crosstalk analysis for gigabit optical transceiver module   Sung-IL Kim   Pacific Rim Conference on Lasers and Electro-Optics (CLEO-PR) 2003, pp.572-572 3
Conference
2003 Optical design of tunable Ld module   최병석   광전자 및 광통신 학술 회의 (COOC) 2003, pp.535-536
Conference
2003 Optical Design for 2D-MOEMS Switch Packaging   엄용성   광전자 및 광통신 학술 회의 (COOC) 2003, pp.437-378
Conference
2002 Fabrication and Characterization of 20GHz Electroabsorption Modulator Module   임지연   Photonics Conference 2002, pp.81-82
Conference
2002 Fabrication and Characteristics of Widely Tunable LD Module   박문호   Photonics Conference 2002, pp.5-6
Conference
2002 Fabrication of 50GHz internal wavelength locker module for multi-channel tunable laser diodes in DWDM applications   박흥우   Photonics Conference 2002, pp.13-14
Conference
2002 Fabrication and measurement of waveguide photodiodes for 40 Gbps optical receiver   권용환   Photonics Conference 2002, pp.85-86