Patent

Registered HEAT DISSIPATING SUBSTRATE COMPRISING DIAMOND AND SEMICONDUCTOR INTEGRATED DEVICE INCLUDING THE SAME

Inventors
Hyung Seok Lee, Bae Sung-Bum
Application No.
17/518511 (2021.11.03)
Publication No.
US2022/0189845 A1 (2022.06.16)
Registration No.
12191227 (2025.01.07)
Country
UNITED STATES
Project Code
20PB6400, Development of Diamond package technology with high heat dissipatiob for GaN Power devices, Hyung Seok Lee
KSP Keywords
Integrated device, Semiconductor integrated
Family
 
패밀리 특허 목록
Status Patent Country KIPRIS
Registered 방열기판, 방열기판의 hod제조방법, 및 이를 포함하는 반도체 집적 장치 KOREA