Registered
Heat dissipating substrate, Method for forming the Heat dissipating substrate, and Semiconductor integrated device using the same
- Inventors
-
Hyung Seok Lee, Bae Sung-Bum
- Application No.
- 2021-0036125 (2021.03.19)
- Publication No.
- 10-2022-0085685 (2022.06.22)
- Registration No.
- 2687720 (2024.07.18)
- Country
- KOREA
- Project Code
-
20PB6400, Development of Diamond package technology with high heat dissipatiob for GaN Power devices,
Hyung Seok Lee
- KSP Keywords
- Semiconductor integrated, integrated device