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Registered METHOD OF FABRICATING PSEUDOMORPHIC HIGH ELECTRON MOBILITY TRANSISTOR

실리콘질화막을 이용한 이중 리세스 구조를 갖는 부정형 고 전자 이동도 트랜지스터의 제조방법
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Inventors
Jong-Won Lim, Hokyun Ahn, Hae Cheon Kim, Mun Jae Kyoung, Woojin Chang, Ji Hong Gu
Application No.
11446750 (2006.06.05)
Publication No.
20070134862 (2007.06.14)
Registration No.
7419862 (2008.09.02)
Country
UNITED STATES
Project Code
05MB1400, SoP(System on Package) for 60 GHz Pico cell Communication, Cho Kyoung Ik
Abstract
Provided is a method of fabricating a pseudomorphic high electron mobility transistor (PHEMT). The method includes the steps of: preparing a substrate including a channel layer and a capping layer that is the uppermost layer; forming a source and a drain on the capping layer; forming a first protective layer on the entire surface of the resultant structure and then patterning the first protective layer to expose a portion of the capping layer in a channel region; removing the exposed portion of the capping layer to form a first recess structure; forming a second protective layer on the entire surface of the resultant structure and then patterning the second protective layer to expose a portion of the substrate in the first recess structure so that a second recess structure is formed; forming a multilayered photoresist layer on the entire surface of the resultant structure and then patterning the multilayered photoresist layer to expose a portion of the substrate through the second recess structure and form a gate-shaped opening; and depositing a metal layer to fill the gate-shaped opening and then removing the multilayered photoresist layer to form a gate connected to the substrate through the second recess structure.
KSP Keywords
Capping layer, Channel layer, High electron, High electron mobility, High electron mobility transistor(HEMT), Protective layer, electron mobility, metal layer, pseudomorphic high electron mobility transistor(pHEMT), recess structure