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Registered CONDENSER MICORPHONE HAVING FLEXURE HINGE DIAPHRAGM AND METHOD OF MANUFACTURING THE SAME
- Inventors
- Hye Jin Kim, Lee Sung Q, Kang-Ho Park, Kim Jongdae
- Application No.
- 13791039 (2013.03.08)
- Publication No.
- 20130244365 (2013.09.19)
- Registration No.
- 8605920 (2013.12.10)
- Country
- UNITED STATES
- Project Code
- 06MB3100, Components/Module technology for Ubiquitous Terminals, Kim Jongdae
- Abstract
- A condenser microphone having a flexure hinge diaphragm and a method of manufacturing the same are provided. The method includes the steps of: forming a lower silicon layer and a first insulating layer; forming an upper silicon layer on the first insulating layer; forming sound holes by patterning the upper silicon layer; forming a second insulating layer and a conductive layer on the upper silicon layer; forming a passivation layer on the conductive layer; forming a sacrificial layer on the passivation layer; depositing a diaphragm on the sacrificial layer, and forming air holes passing through the diaphragm; forming electrode pads on the passivation layer and a region of the diaphragm; and etching the layers to form an air gap between the diaphragm and the upper silicon layer. Consequently, a manufacturing process may improve the sensitivity and reduce the size of the condenser microphone.
- KSP Keywords
- Air holes, Air-gap, Condenser microphone, Conductive layer, Manufacturing processes, Sacrificial layer, Silicon layer, flexure hinge, insulating layer, passivation layer