상세정보
등록 초광대역 시스템 온 패키지 및 그 제조 방법
- 출원번호
- 12604354 (2009.10.22)
- 공개번호
- 20100102425 (2010.04.29)
- 등록번호
- 8049319 (2011.11.01)
- 출원국
- 미국
- 협약과제
- 08MR2800, 고속 이동체 인터넷 위성 무선 연동 기술개발, 이호진
- 초록
- This research discloses an ultra wideband system-on-package (SoP). The SoP includes a package body; a first integrated circuit mounted on the package body; a first signal transmission unit connected to the first integrated circuit; a signal via connected to the first signal transmission unit and including a slab line and a trough line; and a second signal transmission unit connected to the signal via. The technology of the present research can transmit ultra broadband signals by minimizing discontinuity of signals appearing during vertical transition that occurs in the course of a signal transmission to/from an external circuit, and a fabrication method thereof.
- KSP 제안 키워드
- Fabrication method, Integrated circuit, Signal transmission, Ultra-Wide Band(UWB), Ultra-broadband, Vertical Transition, system-on-package, ultra-wideband system, wideband system
- 패밀리
| 구분 | 특허 | 출원국 | KIPRIS |
|---|---|---|---|
| 등록 | 초광대역 시스템 온 패키지 및 그 제조 방법 | 대한민국 | KIPRIS |