상세정보
등록 GOI 기판 위의 칩간 배선
- 출원번호
- 12847174 (2010.07.30)
- 공개번호
- 20110037078 (2011.02.17)
- 등록번호
- 8304859 (2012.11.06)
- 출원국
- 미국
- 협약과제
- 09ZB1400, 수요자 중심 융합부품 개발지원, 정희범
- 초록
- Provided is an optical interconnection device. The optical interconnection device include: a first semiconductor chip disposed on a germanium-on-insulator (GOI) substrate; a light emitter on the GOI substrate, the light emitter receiving an electrical signal from the first semiconductor chip and outputting a light signal; a light detector on the GOI substrate, the light detector sensing the light signal and converting the sensed light signal into an electrical signal; and a second semiconductor chip on the GOI substrate, the second semiconductor chip receiving the electrical signal from the light detector.