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Registered OPTICAL INTERCONNECTION DEVICE

GOI 기판 위의 칩간 배선
이미지 확대
Inventors
Lee Sang-Heung, Hae Cheon Kim, Eun Soo Nam
Application No.
12847174 (2010.07.30)
Publication No.
20110037078 (2011.02.17)
Registration No.
8304859 (2012.11.06)
Country
UNITED STATES
Project Code
09ZB1400, Development support for customer-based convergence components, Hee-Bum Jung
Abstract
Provided is an optical interconnection device. The optical interconnection device include: a first semiconductor chip disposed on a germanium-on-insulator (GOI) substrate; a light emitter on the GOI substrate, the light emitter receiving an electrical signal from the first semiconductor chip and outputting a light signal; a light detector on the GOI substrate, the light detector sensing the light signal and converting the sensed light signal into an electrical signal; and a second semiconductor chip on the GOI substrate, the second semiconductor chip receiving the electrical signal from the light detector.
KSP Keywords
Electrical signal, Germanium on insulator, Optical interconnection, Semiconductor chip, light detector, light emitter