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Detail
Registered SOLID TYPE HEAT DISSIPATION DEVICE
- Inventors
- Moon Seok-Hwan, Kang Seung Youl, Cho Kyoung Ik, Chu Moo Jung
- Application No.
- 12765120 (2010.04.22)
- Publication No.
- 20110056671 (2011.03.10)
- Registration No.
- 8584743 (2013.11.19)
- Country
- UNITED STATES
- Project Code
- 09MB2800, Development of mobile flexible IOP platform, Cho Kyoung Ik
- Abstract
- Provided is a solid type heat dissipation device for electronic communication appliances. The solid type heat dissipation device includes a graphite thin plate horizontally transferring heat, a plurality of metal fillers passing through the graphite thin plate to vertically transfer heat, and a plurality of metal thin plates attached to upper and lower surfaces of the graphite thin plate and connected to the metal fillers.
- KSP Keywords
- Electronic communication, Heat Dissipation, Solid type, Thin plate