상세정보
등록 Interlocking 구조에 의한 플립칩 본딩 방법
- 출원번호
- 14311372 (2014.06.23)
- 공개번호
- 20140302623 (2014.10.09)
- 등록번호
- 9335474 (2016.05.10)
- 출원국
- 미국
- 협약과제
- 09MB1800, ROADM용 광스위치 기술개발, 백용순
- 초록
- Provided is an optical device. The optical device includes a substrate having a waveguide region and a mounting region, a planar lightwave circuit (PLC) waveguide including a lower-clad layer and an upper-clad layer on the waveguide region of the substrate and a platform core between the lower-clad layer and the upper-clad layer, a terrace defined by etching the lower-clad layer on the mounting region of the substrate, the terrace including an interlocking part, an optical active chip mounted on the mounting region of the substrate, the optical active chip including a chip core therein, and a chip alignment mark disposed on a mounting surface of the optical active chip. The optical active chip is aligned by interlocking between the interlocking part of the terrace and the chip alignment mark of the optical active chip and mounted on the mounting region.
- KSP 제안 키워드
- Chip alignment, Clad layer, Optical devices, Planar lightwave circuit(PLC), optical active
- 패밀리
| 구분 | 특허 | 출원국 | KIPRIS |
|---|---|---|---|
| 등록 | 광 소자 및 그 제조 방법 | 대한민국 | KIPRIS |
| 등록 | 광 소자 및 그 제조 방법 | 미국 |