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Detail
Registered MULTI-LAYER INTERCONNECTION STRUCTURE
- Inventors
- Yong Suk Yang, In-Kyu You, Yong-Young Noh, Koo Jae Bon
- Application No.
- 13939801 (2013.07.11)
- Publication No.
- 20130292160 (2013.11.07)
- Registration No.
- 9184063 (2015.11.10)
- Country
- UNITED STATES
- Project Code
- 09IC1900, Development of Next Generation RFID Technology for Item Level Applications, Chae Jong- Suk
- Abstract
- Provided are a multi-layer interconnection structure and a manufacturing method thereof. The multi-layer interconnection structure includes a substrate; a first wiring on the substrate; an interlayer insulation layer on the first wiring; a second wiring on the interlayer insulation layer; and a via contact including at least one conductive filament penetrating through the interlayer insulation layer between the second wiring and the first wiring to be electrically connected to the first wiring and the second wiring.