상세정보
등록 다층 배선 구조의 반도체 소자 및 그 제조 방법
- 출원번호
- 13939801 (2013.07.11)
- 공개번호
- 20130292160 (2013.11.07)
- 등록번호
- 9184063 (2015.11.10)
- 출원국
- 미국
- 협약과제
- 09IC1900, 개별물품 단위 응용을 위한 차세대 RFID 기술 개발, 채종석
- 초록
- Provided are a multi-layer interconnection structure and a manufacturing method thereof. The multi-layer interconnection structure includes a substrate; a first wiring on the substrate; an interlayer insulation layer on the first wiring; a second wiring on the interlayer insulation layer; and a via contact including at least one conductive filament penetrating through the interlayer insulation layer between the second wiring and the first wiring to be electrically connected to the first wiring and the second wiring.
- KSP 제안 키워드
- Conductive Filament, Insulation layer, Interconnection structure, Manufacturing method, multi-layer