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Detail
Registered SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Inventors
- Woojin Chang, Jong-Won Lim, Hae Cheon Kim, Eun Soo Nam
- Application No.
- 13013912 (2011.01.26)
- Publication No.
- 20120086118 (2012.04.12)
- Registration No.
- 8455992 (2013.06.04)
- Country
- UNITED STATES
- Project Code
- 10MR3100, Development of Radio Wave Propagation Environment and Wireless Transmission Platform Technologies in Tera-Hertz Frequency Range, Tae Jin Chung
- Abstract
- Provided is a semiconductor package and a method of fabricating the same. The semiconductor package includes: a package body including a plurality of sheets; semiconductor chips mounted in the package body; and an external connection terminal provided on a first side of the package body, wherein the sheets are stacked in a parallel direction to the first side.