등록
고주파 신호 전달을 위한 광모듈 패키징 방법
- 발명자
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한영탁, 신장욱, 한상필, 박상호, 백용순
- 출원번호
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14987808 (2016.01.05)
- 공개번호
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20160116694 (2016.04.28)
- 등록번호
- 9507109 (2016.11.29)
- 출원국
- 미국
- 협약과제
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10MB3800, 100G 이더넷용 광송수신기 개발,
백용순
- 초록
- Provided is an optical module. The optical module includes: an optical bench having a first trench of a first depth and a second trench of a second depth that is lower than the first depth; a lens in the first trench of the optical bench; at least one semiconductor chip in the second trench of the optical bench; and a flexible printed circuit board covering an upper surface of the optical bench except for the first and second trenches, wherein the optical bench is a metal optical bench or a silicon optical bench.
- KSP 제안 키워드
- Circuit Board, Flexible Printed Circuit, Flexible printed circuit board(FPCB), Optical module, Semiconductor chip, Silicon optical bench(SIOB), printed circuit, printed circuit board(PCB)
- 패밀리
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