상세정보
등록 금속-반도체 융합 전자 회로 장치 및 이를 이용한 전자회로 시스템
- 출원번호
- 13703886 (2011.07.01)
- 공개번호
- 20130087786 (2013.04.11)
- 등록번호
- 9035427 (2015.05.19)
- 출원국
- 미국
- 협약과제
- 10MB2700, 전기적 점프(Current Jump)를 이용한 신소자 기술, 김현탁
- 초록
- Provided are metal-semiconductor convergence electric circuit devices. The device includes a semiconductor device, a metal resistor exhibiting resistance increased with an increase in temperature thereof, and an interconnection line connecting the semiconductor device with the metal resistor in series and having a resistance lower than that of the metal resistor. The semiconductor device is configured to exhibit resistance decreased with an increase in temperature thereof and compensate the resistance increase of the metal resistor.
- KSP 제안 키워드
- electric circuit, interconnection line, metal-semiconductor, semiconductor device