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Detail
Registered SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF
- Inventors
- Min Byoung-Gue, Hyung Sup Yoon, Mun Jae Kyoung, Kim Seong-Il, Jongmin Lee
- Application No.
- 13549795 (2012.07.16)
- Publication No.
- 20130026631 (2013.01.31)
- Registration No.
- 8692371 (2014.04.08)
- Country
- UNITED STATES
- Project Code
- 10MB4400, Open Lab Power Amplifier Platform Technology for Wireless Communication and xAN, Hyung Sup Yoon
- Abstract
- Disclosed are a semiconductor apparatus and a manufacturing method thereof. The manufacturing method of the semiconductor apparatus includes: forming a semiconductor chip on a semiconductor substrate; adhering a carrier wafer with a plurality of through holes onto the semiconductor chip; polishing the semiconductor substrate; forming a first via hole at the rear side of the polished semiconductor substrate; forming a first metal layer below the polished semiconductor substrate and at the first via hole; and removing the carrier wafer from the polished semiconductor substrate.
- KSP Keywords
- Manufacturing method, Semiconductor chip, Via-hole, metal layer, rear side, semiconductor substrate, through-holes