상세정보
등록 열방출이 용이한 반도체 기판의 비아홀 제작 방법
- 출원번호
- 13549795 (2012.07.16)
- 공개번호
- 20130026631 (2013.01.31)
- 등록번호
- 8692371 (2014.04.08)
- 출원국
- 미국
- 협약과제
- 10MB4400, 무선통신 /xAN을 위한 개방형 Power Amplifier 플랫폼 기술, 윤형섭
- 초록
- Disclosed are a semiconductor apparatus and a manufacturing method thereof. The manufacturing method of the semiconductor apparatus includes: forming a semiconductor chip on a semiconductor substrate; adhering a carrier wafer with a plurality of through holes onto the semiconductor chip; polishing the semiconductor substrate; forming a first via hole at the rear side of the polished semiconductor substrate; forming a first metal layer below the polished semiconductor substrate and at the first via hole; and removing the carrier wafer from the polished semiconductor substrate.
- KSP 제안 키워드
- Manufacturing method, Semiconductor chip, Via-hole, metal layer, rear side, semiconductor substrate, through-holes