상세정보
등록 광송신 및 광수신 모듈에서 연성 인쇄회로기판 및 인쇄회로기판 간의 고속 RF 신호 연결방법
- 출원번호
- 13910213 (2013.06.05)
- 공개번호
- 20140147128 (2014.05.29)
- 등록번호
- 9265140 (2016.02.16)
- 출원국
- 미국
- 협약과제
- 12MB2200, 100G 이더넷용 광송수신기 개발, 백용순
- 초록
- Provided are structures for connecting trace lines of printed circuit boards and optical transceiver modules with the same. The module may include an optical transmitter/receiver part, a signal processing unit, a flexible PCB, and a rigid PCB. The flexible PCB may include a first signal line, and the rigid PCB may include a second signal line. The flexible PCB and the rigid PCB may be overlapped with each other. The first signal line and the second signal line may not be overlapped with each other and be electrically connected to each other by a junction soldering structure. It is possible to transmit high quality and high frequency signals through the first and second signal lines.
- 패밀리
| 구분 | 특허 | 출원국 | KIPRIS |
|---|---|---|---|
| 등록 | 광송수신용 인쇄회로기판들의 배선 연결 구조 및 그를 구비한 광송수신 모듈 | 대한민국 | KIPRIS |