BROWSE
Detail
Registered COMPONENT PACKAGE INCLUDING MATCHING CIRCUIT AND MATCHING METHOD THEREOF
- Inventors
- Dong Min Kang, Jong-Won Lim, Hokyun Ahn, Hyung Sup Yoon, Kim Seong-Il, Lee Sang-Heung, Ju Chull Won
- Application No.
- 14478295 (2014.09.05)
- Publication No.
- 20150270822 (2015.09.24)
- Registration No.
- 9438199 (2016.09.06)
- Country
- UNITED STATES
- Project Code
- 13ZB1100, 스마트 융.복합 IT부품소재 기술개발, Eun Soo Nam
- Abstract
- Provided herein is a component package including a matching unit and a matching method thereof, the matching unit including: a substrate; a transmission line formed on the substrate, the transmission line being connected to a terminal of the component package; a bonding wire electrically connecting the transmission line and a central component; and a capacitor unit having a plurality of capacitors electrically connected with the transmission line by wiring connection, wherein an inductance of the matching unit is variable by adjusting a length of the bonding wire, and a capacitance of the matching unit is variable by increasing or reducing the number of capacitors electrically connected to the transmission line, of among the capacitors inside the capacitor unit, by extending or cutting off the wiring connection.
- KSP Keywords
- Bonding wires, Cutting off, Transmission line, matching circuit, matching method
- Family
| Status | Patent | Country | KIPRIS |
|---|---|---|---|
| Registered | COMPONENT PACKAGE INCLUDING MATCHING CIRCUIT AND MATCHING METHOD THEREOF | KOREA | KIPRIS |