BROWSE
Detail
Registered TRANSMITTING AND RECEIVING PACKAGE
- Inventors
- Eom Yong Sung, Bae Hyun-Cheol, Choi Kwang-Seong, Haksun Lee, Moon Seok-Hwan, Jihye Son
- Application No.
- 14958927 (2015.12.03)
- Registration No.
- 9490198 (2016.11.08)
- Country
- UNITED STATES
- Project Code
- 15ZB1400, ESSOP CUBE 기술 기반 차세대 레이더 3D 모듈 개발, Lee Jin Ho
- Abstract
- Provided is a transmitter and receiver package including an interposer substrate including a top surface, a bottom surface facing the top surface, and a through-via, semiconductor devices mounted on the top surface of the interposer substrate, an exothermic element mounted on the bottom surface of the interposer substrate, and a heat dissipation member disposed on the bottom surface of the interposer substrate, the heat dissipation member being configured to cover the exothermic element.
- KSP Keywords
- Bottom surface, Heat Dissipation, Transmitter and receiver, semiconductor device
- Family
| Status | Patent | Country | KIPRIS |
|---|---|---|---|
| Registered | 송수신 패키지 | KOREA |