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Registered TRANSMITTING AND RECEIVING PACKAGE

플립칩 패키지를 위한 3차원 적층 공정 기술
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Inventors
Eom Yong Sung, Bae Hyun-Cheol, Choi Kwang-Seong, Haksun Lee, Jihye Son, Moon Seok-Hwan
Application No.
14958927 (2015.12.03)
Registration No.
9490198 (2016.11.08)
Country
UNITED STATES
Project Code
15ZB1400, ESSOP CUBE 기술 기반 차세대 레이더 3D 모듈 개발, Lee Jin Ho
Abstract
Provided is a transmitter and receiver package including an interposer substrate including a top surface, a bottom surface facing the top surface, and a through-via, semiconductor devices mounted on the top surface of the interposer substrate, an exothermic element mounted on the bottom surface of the interposer substrate, and a heat dissipation member disposed on the bottom surface of the interposer substrate, the heat dissipation member being configured to cover the exothermic element.
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Status Patent Country KIPRIS
Registered TRANSMITTING AND RECEIVING PACKAGE KOREA