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Registered METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE

Inventors
Choi Kwang-Seong, Bae Hyun-Cheol, Haksun Lee, Lee Jin Ho, Eom Yong Sung
Application No.
14/958341 (2015.12.03)
Registration No.
9853010 (2017.12.26)
Country
UNITED STATES
Project Code
15ZB1400, ESSOP CUBE 기술 기반 차세대 레이더 3D 모듈 개발, Lee Jin Ho
KSP Keywords
Semiconductor package
Family
 
패밀리 특허 목록
Status Patent Country KIPRIS
Registered 반도체 패키지의 제조 방법 KOREA KIPRIS