BROWSE
Detail
Registered ELECTROPLATING APPARATUS
- Inventors
- Cheong Woo-Seok
- Application No.
- 15695934 (2017.09.05)
- Publication No.
- 20180087174 (2018.03.29)
- Registration No.
- 10822712 (2020.11.03)
- Country
- UNITED STATES
- Abstract
- An electroplating apparatus includes a substrate, a seed layer provided on a top surface of the substrate, a high-voltage portion provided on a bottom surface of the substrate, a housing sealing the high-voltage portion, an anode structure spaced apart from the seed layer in a direction perpendicular to the top surface of the substrate, first power source generating a first voltage difference between the seed layer and the anode structure, and a second power source applying a second voltage to the high-voltage portion. A positive terminal of the first power source is electrically connected to the anode structure, and a negative terminal of the first power source is electrically connected to the seed layer.
- KSP Keywords
- Anode structure, Bottom surface, High Voltage, Seed layer, The seed layer, Voltage difference, power source
- Family
| Status | Patent | Country | KIPRIS |
|---|---|---|---|
| Registered | 전기 도금 장치 | KOREA | KIPRIS |