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Registered COOLING DEVICE

응력 유도를 이용한 냉각장치 구조 및 제작 방법
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Inventors
Kim Junsoo, Jaewoo Lee, Lee Seung Min, Im Solyee, Moon Seungeon, 권정윤
Application No.
15656711 (2017.07.21)
Publication No.
20180119999 (2018.05.03)
Registration No.
10571161 (2020.02.25)
Country
UNITED STATES
Abstract
Provided is a cooling device including a valve structure including a temperature-responsive material that changes in volume in response to changes in temperature, a supporting structure, which is joined to the valve structure and supports the valve structure, and a solvent which contacts the valve structure, wherein a portion of the solvent contacts the valve structure and another portion of the solvent is externally exposed, the valve structure changes in volume in response to changes in temperature and thereby regulating the externally exposed surface area of the solvent.
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Status Patent Country KIPRIS
Registered COOLING DEVICE KOREA KIPRIS