16PB1200, Development of polycrystalline thermoelectric material for solid state electronic cooling ,
Moon Seungeon
Abstract
본 발명은 열전성능 측정장치에 관한 것으로, 열전성능을 측정하는 열전성능 측정 장치에 있어서, 열전소재의 양단에 온도차를 발생시키는 지지모듈, 지지모듈과 탈착 가능하게 결합되고, 열전소재를 지지하는 고정모듈, 고정모듈과 전기적으로 연결되고, 열전소재 양단의 온도를 측정하는 온도 측정부, 및 고정모듈과 전기적으로 연결되고, 열전소재의 양단에 발생하는 열기전력을 측정하는 기전력 측정부를 포함하되, 고정모듈은 열전소재의 양단의 각각을 지지하는 제 1 히트싱크부 및 제 2 히트싱크부를 포함하는 열전성능 측정 장치가 제공된다.
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J. Kim et. al, "Trends in Lightweight Kernel for Many core Based High-Performance Computing", Electronics and Telecommunications Trends. Vol. 32, No. 4, 2017, KOGL Type 4: Source Indication + Commercial Use Prohibition + Change Prohibition
J. Sim et.al, “the Fourth Industrial Revolution and ICT – IDX Strategy for leading the Fourth Industrial Revolution”, ETRI Insight, 2017, KOGL Type 4: Source Indication + Commercial Use Prohibition + Change Prohibition
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