상세정보
등록 FPCB를 이용한 광송신 및 수신모듈의 고주파 배선 및 임피던스 정합 방법
- 출원번호
- 16572089 (2019.09.16)
- 공개번호
- 20200241226 (2020.07.30)
- 등록번호
- 10935741 (2021.03.02)
- 출원국
- 미국
- 협약과제
- 18HB2900, 데이터센터 통신용량 증대를 위한 저전력 On-Board 집적 400Gbps 광송수신 엔진 기술, 백용순
- 초록
- Provided is an optical module including an optical waveguide device through which multiple channel lightwaves are input and output, an optical transmission/reception unit disposed on one side of the optical waveguide device, an electronic IC disposed on one side of the optical transmission/reception unit and configured to drive the optical transmission/reception unit, a flexible printed circuit board (PCB) disposed on the optical transmission/reception unit and the electronic IC, a first solder ball between the optical transmission/reception unit and the flexible PCB and a second solder ball between the electronic IC and the flexible PCB.
- KSP 제안 키워드
- Ball bonding, Bonding structure, Circuit Board, Flexible PCB, Flexible Printed Circuit, Flexible printed circuit board(FPCB), Multiple channels, Optical module, Optical waveguide device, Optical waveguides, Solder ball, Waveguide devices, input and output, optical transmission, printed circuit, printed circuit board(PCB)
- 패밀리
| 구분 | 특허 | 출원국 | KIPRIS |
|---|---|---|---|
| 등록 | 광 모듈 및 솔더볼 접합 구조체 | 대한민국 | KIPRIS |