Registered
OPTICAL MODULE AND SOLDER BALL BONDING STRUCTURE
- Inventors
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Han Young-Tak, Jong-Hoi Kim, Lee Seo Young, Shin Jang Uk, Kimseoktae, Park Sang Ho, Baek Yongsoon
- Application No.
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16572089 (2019.09.16)
- Publication No.
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20200241226 (2020.07.30)
- Registration No.
- 10935741 (2021.03.02)
- Country
- UNITED STATES
- Project Code
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18HB2900, Development of low power On-Board integrated 400Gbps Trasmitting/Receiving Optical Engine for Hyper-scale Data Center,
Baek Yongsoon
- Abstract
- Provided is an optical module including an optical waveguide device through which multiple channel lightwaves are input and output, an optical transmission/reception unit disposed on one side of the optical waveguide device, an electronic IC disposed on one side of the optical transmission/reception unit and configured to drive the optical transmission/reception unit, a flexible printed circuit board (PCB) disposed on the optical transmission/reception unit and the electronic IC, a first solder ball between the optical transmission/reception unit and the flexible PCB and a second solder ball between the electronic IC and the flexible PCB.
- KSP Keywords
- Ball bonding, Bonding structure, Circuit Board, Flexible PCB, Flexible Printed Circuit, Flexible printed circuit board(FPCB), Multiple channels, Optical module, Optical waveguide device, Optical waveguides, Solder ball, Waveguide devices, input and output, optical transmission, printed circuit, printed circuit board(PCB)
- Family
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