BROWSE
Detail
Registered OPTICAL MODULE AND SOLDER BALL BONDING STRUCTURE
- Inventors
- Han Young-Tak, Lee Seo Young, Kimseoktae, Shin Jang Uk, Jong-Hoi Kim, Park Sang Ho, Baek Yongsoon
- Application No.
- 16572089 (2019.09.16)
- Publication No.
- 20200241226 (2020.07.30)
- Registration No.
- 10935741 (2021.03.02)
- Country
- UNITED STATES
- Project Code
- 18HB2900, Development of low power On-Board integrated 400Gbps Trasmitting/Receiving Optical Engine for Hyper-scale Data Center, Baek Yongsoon
- Abstract
- Provided is an optical module including an optical waveguide device through which multiple channel lightwaves are input and output, an optical transmission/reception unit disposed on one side of the optical waveguide device, an electronic IC disposed on one side of the optical transmission/reception unit and configured to drive the optical transmission/reception unit, a flexible printed circuit board (PCB) disposed on the optical transmission/reception unit and the electronic IC, a first solder ball between the optical transmission/reception unit and the flexible PCB and a second solder ball between the electronic IC and the flexible PCB.
- KSP Keywords
- Ball bonding, Bonding structure, Circuit Board, Flexible PCB, Flexible printed circuit, Flexible printed circuit board, Input-Output, Multiple channels, Optical module, Optical waveguide device, Solder ball, optical transmission, optical waveguides, printed circuit, printed circuit board(PCB), waveguide device
- Family
| Status | Patent | Country | KIPRIS |
|---|---|---|---|
| Registered | 광 모듈 및 솔더볼 접합 구조체 | KOREA | KIPRIS |