실리카 AWG 칩과 광결합된 DML 기반 광송신 모듈의 외부 광반사 효과에 의한 변조대역폭 확장 방법
한영탁, 윤석준, 신장욱, 백용순, 김석태, 이서영, 박상호
- 11381315 (2022.07.05)
19HB2100, 데이터센터 통신용량 증대를 위한 저전력 On-Board 집적 400Gbps 광송수신 엔진 기술,
- Disclosed is an optical transmitter module including a directly modulated laser transmitter based on a directly modulated laser (DML) and an arrayed waveguide grating (AWG) chip that is vertically polished. The directly modulated laser transmitter includes a directly modulated laser chip array including one or more directly modulated laser chips, an impedance matching circuit that allows each of the one or more directly modulated laser chips to operate at a critical speed of 100 Gbps per channel or higher, and a radio frequency-flexible printed circuit board (RF-FPCB) that transmits a radio frequency (RF) modulating signal to the directly modulated laser chip array. The arrayed waveguide grating chip includes an optical waveguides that transfer multi-channel optical signals and a wavelength multiplexer that multiplexes the multi-channel optical signals. The directly modulated laser transmitter and the arrayed waveguide grating chip are spaced apart from each other and are optically coupled in chip-to-chip.
- KSP 제안 키워드
- 100 Gbps, Chip array, Circuit Board, Directly modulated, Directly modulated laser(DML), Flexible Printed Circuit, Flexible printed circuit board(FPCB), Laser transmitter, Modulated laser, Modulating signal, Optical transmitters, Optical waveguides, Radio Frequency(RF), Radio frequency (rf), Waveguide grating, Wavelength multiplexer, arrayed waveguide grating(AWG), chip-to-chip, critical speed, impedance matching, impedance matching circuit, matching circuit, multi-channel, printed circuit, printed circuit board(PCB)