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Year ~ Keyword

Detail

Registered 반도체 패키지

Inventors
이희동, 박봉혁, 공선우, 장승현, 왕승훈, 현석봉
Application No.
2022-0171264 (2022.12.09)
Registration No.
2830332 (2025.07.01)
Country
KOREA
Project Code
22HH4400, Development of THz band RF core component technology , Seok Bong Hyun
KSP Keywords
Semiconductor package