Registered
다이 간 통신을 수행하는 장치 및 방법
- Inventors
-
한진호, 김주엽, 권영수
- Application No.
- 2022-0176680 (2022.12.16)
- Registration No.
- 2926991 (2026.02.09)
- Country
- KOREA
- Project Code
-
22JS1700, PIM 2.5D Large-Scale Super-Performance Interposer and 3D Hybrid Bonding Platform for PIM Seimconductor integrating Processors and High-Bandwidth Memor,
Kwon Young-Su