01MM1900, Microwave (1~20GHz) Wafer Level Package,
Ju Chull Won
Abstract
가. Pad 재배치용 유전박막 공정 기술개발 나. 웨이퍼 레벨 패키지용 bump 형성기술 개발 다. 20GHz 신호배선 설계기술 확보 라. 20GHz급 WLP 시제품1종 개발
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