hybrid sensor, large area, platform technology, sensor platform, wafer level
Funding Org.
산업통상자원부
Research Org.
한국전자통신연구원
Project Code
23PB1200, Development of flexible and stretchable hybrid sensor platform technology for formfactor-free highly integrated sensors,
Hye Jin Kim
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J. Kim et. al, "Trends in Lightweight Kernel for Many core Based High-Performance Computing", Electronics and Telecommunications Trends. Vol. 32, No. 4, 2017, KOGL Type 4: Source Indication + Commercial Use Prohibition + Change Prohibition
J. Sim et.al, “the Fourth Industrial Revolution and ICT – IDX Strategy for leading the Fourth Industrial Revolution”, ETRI Insight, 2017, KOGL Type 4: Source Indication + Commercial Use Prohibition + Change Prohibition
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