High performance, High-density, Passive elements, Si interposer, silicon interposer
Funding Org.
산업통상자원부
Research Org.
세종대학교
Project Code
24PS2300, Development of a high-density, passive-component-embedded silicon interposer platform for 2.5D high-performance system semiconductors,
Kim Yi-Gyeong
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J. Kim et. al, "Trends in Lightweight Kernel for Many core Based High-Performance Computing", Electronics and Telecommunications Trends. Vol. 32, No. 4, 2017, KOGL Type 4: Source Indication + Commercial Use Prohibition + Change Prohibition
J. Sim et.al, “the Fourth Industrial Revolution and ICT – IDX Strategy for leading the Fourth Industrial Revolution”, ETRI Insight, 2017, KOGL Type 4: Source Indication + Commercial Use Prohibition + Change Prohibition
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