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Journal
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2025 |
Through-glass-via interposer for high-speed electrical interfacing in a 400 Gbps optical engine for on-board optics and pluggable optical transceivers
Eun Kyu Kang
Journal of Lightwave Technology, v.권호미정, pp.1-10 |
0 |
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Conference
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2024 |
Evaluation of Solder-Join Repair on Glass Interposers for CPO Optical Module Maintenance Solutions
권상진
Photonics Conference 2024, pp.1-2 |
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Journal
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2024 |
Compact lithium niobate plasmonic modulator
Myunghwan Kim
Optics Letters, v.49, no.4, pp.939-942 |
0 |
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Conference
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2023 |
A Study of the Laser Soldering Process for High-frequency PCB Substrate
권상진
Photonics Conference 2023, pp.1-2 |
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Conference
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2023 |
Fabrication and analysis of TGV(Through glass via) for Co-Packaged Optics
강은규
Photonics Conference 2023, pp.1-2 |
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Conference
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2023 |
Wavelength change of 2x4 LWDM EML TOSA depending on TEC cooling condition
정수용
Photonics Conference 2023, pp.1-2 |
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Conference
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2022 |
Non-contact High Speed POB Solder Joint Process Using Laser Heating
권상진
Photonics Conference 2022, pp.1-2 |
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Conference
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2022 |
TEC power consumption of the 8 channel EML TOSA module
권원배
Photonics Conference 2022, pp.1-2 |
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Conference
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2021 |
Cooling Performance of QSFP-DD800 Optical Transceiver for Datacenter Network
권상진
Photonics Conference 2021, pp.1-2 |
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Conference
|
2021 |
Transmitter Optical Engine with Glass Interposer
김대선
Photonics Conference 2021, pp.1-2 |
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Conference
|
2021 |
Thermal Characteristic of the 800Gbps Non-hermetic Package
권원배
Photonics Conference 2021, pp.1-2 |
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Conference
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2020 |
Electrode Interconnection of Glass VIA and Ceramic Optical-bench by using localized Laser Heating for High-speed Optical Communication Module
권상진
Photonics Conference 2020, pp.1-2 |
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